Abstract: A multi-wire slurry-free wafer cutting apparatus along with a method for optimizing saw operation is disclosed that includes a cutting wire impregnated with a plurality of cutting particles wrapped multiple times around two or more wire guides to form a multi-wire web. A drive mechanism drives the web across an ingot at an optimum speed determined by setting a multi-wire web speed to an initial speed, detecting vibration of the web, identifying the web speed having a lowest vibration, and operating the drive mechanism at that speed as optimum. A cleansing fluid is applied to the multi-wire web that includes a major portion of water and a minor portion of surfactant which cleans the cutting wire and keeps the cut particles free of oxidation. One or more cleansing fluid applicators are configured to apply the cleansing fluid to the multi-wire web close to the ingot in a laminar flow.

Abstract: A dressing disk for dressing and reconditioning the polishing pad of a planetary disk polishing machine is fabricated by plating a nickel/diamond matrix layer onto a stainless steel disk wherein the matrix layer thickness is developed or plated to a thickness which leaves exposed about 25 percent of the fine diamond particles, thereby forming a surface that has the look and feel of medium to coarse sandpaper. The dressing disks are inserted into the holes in a disk carrier of a planetary polishing machine and driven by its central rotary drive.