Abstract: Methods and apparatus for facilitating data throughput improvements in interconnect fabrics employing point-to-point links using dynamically selectable routing. Initiators and targets are operatively coupled to first and second fabrics. The first and second fabrics include multiple point-to-point internal links and are communicatively coupled to one another via multiple fabric-to-fabric links, including first and second links from the first fabric to the second fabric. During operations, traffic on the first fabric-to-fabric link is detected to determine if it is busy, and depending on the determination, data transfers from an initiator coupled to the first fabric destined for a target coupled to the second fabric are selectively routed via either the first or second fabric-to-fabric links.

Abstract: Methods and apparatus for facilitating data throughput improvements in interconnect fabrics employing point-to-point links using dynamically selectable routing. Initiators and targets are operatively coupled to first and second fabrics. The first and second fabrics include multiple point-to-point internal links and are communicatively coupled to one another via multiple fabric-to-fabric links, including first and second links from the first fabric to the second fabric. During operations, traffic on the first fabric-to-fabric link is detected to determine if it is busy, and depending on the determination, data transfers from an initiator coupled to the first fabric destined for a target coupled to the second fabric are selectively routed via either the first or second fabric-to-fabric links.

Abstract: An integrated circuit assembly and a method for distributed broadcasting of high speed chip input signals to a series of on-chip destination cells is provided, which eliminates the need for input buffers. A bufferless distributed broadcasting path is provided by matching the impedances off-chip conductive trace, i.e. a package trace, which together with interface circuitry forms a first transmission line, and on-chip conductive traces which form a second transmission line, to provide a constant impedance transmission line extending from a package trace to the far end of the on-chip trace. The method of bufferless distributed circuit (BDC) broadcasting is applicable to chip designs such as a crosspoint switch, parallel multiplier and distributed amplifier, and provides advantages of lower signal delay and power dissipation. In an experimental GaAs HBT 8.times.