Patents by Inventor Kesayuki Sonehara

Kesayuki Sonehara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame and semiconductor device
    Patent number: 10665533
    Abstract: A lead frame includes a conductive member, a plating layer, and an oxide film. The conductive member includes a rough surface. The plating layer is formed on the rough surface and configured to be connected to a semiconductor element. The oxide film covers the rough surface at least around the plating layer.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: May 26, 2020
    Assignee: Shinko Electric Industries, Co., Ltd.
    Inventors: Kesayuki Sonehara, Muneaki Kure, Yosuke Aruga
  • LEAD FRAME AND SEMICONDUCTOR DEVICE
    Publication number: 20190157196
    Abstract: A lead frame includes a conductive member, a plating layer, and an oxide film. The conductive member includes a rough surface. The plating layer is formed on the rough surface and configured to be connected to a semiconductor element. The oxide film covers the rough surface at least around the plating layer.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 23, 2019
    Inventors: Kesayuki SONEHARA, Muneaki KURE, Yosuke ARUGA
  • Lead frame and method of manufacturing the same
    Publication number: 20040046237
    Abstract: A lead frame includes a frame portion and a plurality of land-like conductor portions arranged in a lattice pattern in a region within the frame portion. The frame portion and the land-like conductor portions are supported by an adhesive tape. Each of the land-like conductor portions is formed of part of each of a plurality of leads at a portion where each lead intersects each other, the plurality of leads being discontinuously arranged so as to be orthogonal to each other. Each portion where the leads intersect each other is formed to be larger than a width of the corresponding lead.
    Type: Application
    Filed: September 4, 2003
    Publication date: March 11, 2004
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD
    Inventors: Akinobu Abe, Tetsuichiro Kasahara, Kesayuki Sonehara