Patents by Inventor Kesvakumar Muniandy

Kesvakumar Muniandy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink for semiconductor package
    Publication number: 20070200225
    Abstract: A heat sink (10) for a semiconductor package (38) includes a top surface (12) having a recessed hole (16) at its center. A sidewall (14) formed around the top surface (12) of the heat sink (10) has gaps (18) formed in the sidewall (14). An air vent (22) is formed at a corner of the heat sink (10). The heat sink (10) is used for center gate molding. Mold compound (24) enters the recessed hole (16), covers an IC die 30, and exits via the gaps (18). During mold injection, air escapes through the air vent (22).
    Type: Application
    Filed: February 28, 2006
    Publication date: August 30, 2007
    Inventors: Ruzaini Ibrahim, Kong Tiu, Kesvakumar Muniandy