Patents by Inventor Keumhee Oh

Keumhee Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate for semiconductor package and method for manufacturing the same
    Publication number: 20120164791
    Abstract: Disclosed herein are a substrate for a semiconductor package and a method for manufacturing the same. The substrate for the semiconductor package includes: a semiconductor chip forming region; and a hydrophobic film for controlling the flow of an adhesive for bonding a semiconductor chip in a portion of a solder resist layer. According to the present invention, a molecular film type of chemically treated hydrophobic film is formed to effectively control the flow of epoxy resin as an adhesive for bonding a semiconductor chip at a location where the epoxy resin meets the hydrophobic film. Also, a part to be controlled is bonded to a substrate through chemical bonding, thereby maintaining a very stable form.
    Type: Application
    Filed: November 10, 2011
    Publication date: June 28, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Kim, Keumhee Oh, Jeongwoo Ha