Patents by Inventor Keum Hwan PARK

Keum Hwan PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10468206
    Abstract: A method for patterning an amorphous alloy is provided. The method includes forming a pattern for defining an amorphous alloy deposition region on a parent material, forming an amorphous alloy deposition layer on the parent material with the pattern formed thereon, and etching a region except for the amorphous alloy deposition region. A dome switch is provided. The dome switch includes a metal layer shaped like a dome, a central portion of which protrudes, and, in response to external force being received through the protruding central portion, the central portion contacting and electrically connected to a circuit board, and an amorphous alloy layer disposed on the metal layer. Accordingly, an amorphous alloy structure with enhanced durability and reliability is easily manufactured.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-soo Park, Keum-hwan Park, Ju-ho Lee, Jin-man Park
  • Patent number: 10195661
    Abstract: An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-man Park, Keum-hwan Park, Eun-soo Park, Ju-ho Lee
  • Patent number: 10087514
    Abstract: An amorphous and nano nitride composite thin film, a method for forming the same, and an electronic device having the same are provided. The amorphous and nano nitride composite thin film has a composite structure in which a nitride phase that includes Zr and Al as nitride constituent elements and at least one metal phase are mixed, wherein the metal phase includes at least one element selected from the group including Cu and Ni, the nitride phase includes a ZrN crystalline phase in which a size of a grain is in the range of 10 nm to 500 nm, and a volume fraction of the ZrN crystalline phase is 10% or more.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: October 2, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-soo Park, Keum-hwan Park, Jin-man Park, Seok-moo Hong, Sung-ho Cho, Moung-kwan Park, Jae-won Sim
  • Patent number: 10070515
    Abstract: A transparent electrode using an amorphous alloy is provided. The transparent electrode includes a flexible substrate and an amorphous alloy layer configured to have conductivity and to be formed on the flexible substrate so as to have a plurality of voids.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: September 4, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-soo Park, Keum-hwan Park, Ju-Ho Lee, Jin-man Park, Young-soo Lee
  • Patent number: 9870840
    Abstract: According to example embodiments, a metallic glass includes aluminum (Al), a first element group, and a second element group. The first element group includes at least one of a transition metal and a rare earth element. The second element group includes at least one of an alkaline metal, an alkaline-earth metal, a semi-metal, and a non-metal. The second element group and aluminum have an electronegativity difference of greater than or equal to about 0.25. The second element group is included less than or equal to about 3 at % of the metallic glass, based on the total amount of the aluminum (Al), the first element group, and the second element group. A conductive paste and/or an electrode of an electronic device may be formed using the metallic glass.
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: January 16, 2018
    Assignees: Samsung Electronics Co., Ltd., Yonsi University, University-Industry Foundation (UIF)
    Inventors: Jin Man Park, Keum Hwan Park, Eun Sung Lee, Suk Jun Kim, Se Yun Kim, Sang Soo Jee, Do-hyang Kim
  • Patent number: 9615454
    Abstract: A transparent conductor includes a metallic glass, and a method of manufacturing a transparent conductor includes: preparing a metallic glass or a mixture comprising the metallic glass; and firing the metallic glass or the mixture comprising the metallic glass at a predetermined temperature higher than a glass transition temperature of the metallic glass.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: April 4, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Se Yun Kim, Eun Sung Lee, Keum Hwan Park, Weon Ho Shin, Suk Jun Kim, Jin Man Park, Sang Soo Jee
  • Publication number: 20170048972
    Abstract: A transparent electrode using an amorphous alloy is provided. The transparent electrode includes a flexible substrate and an amorphous alloy layer configured to have conductivity and to be formed on the flexible substrate so as to have a plurality of voids.
    Type: Application
    Filed: June 7, 2016
    Publication date: February 16, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-soo PARK, Keum-hwan PARK, Ju-ho LEE, Jin-man PARK, Young-soo LEE
  • Publication number: 20170034965
    Abstract: An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.
    Type: Application
    Filed: April 11, 2016
    Publication date: February 2, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-man PARK, Keum-hwan PARK, Eun-soo PARK, Ju-ho LEE
  • Publication number: 20170004931
    Abstract: A method for patterning an amorphous alloy is provided. The method includes forming a pattern for defining an amorphous alloy deposition region on a parent material, forming an amorphous alloy deposition layer on the parent material with the pattern formed thereon, and etching a region except for the amorphous alloy deposition region. A dome switch is provided. The dome switch includes a metal layer shaped like a dome, a central portion of which protrudes, and, in response to external force being received through the protruding central portion, the central portion contacting and electrically connected to a circuit board, and an amorphous alloy layer disposed on the metal layer. Accordingly, an amorphous alloy structure with enhanced durability and reliability is easily manufactured.
    Type: Application
    Filed: April 11, 2016
    Publication date: January 5, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-soo PARK, Keum-hwan PARK, Ju-ho LEE, Jin-man PARK
  • Publication number: 20160215383
    Abstract: An amorphous and nano nitride composite thin film, a method for forming the same, and an electronic device having the same are provided. The amorphous and nano nitride composite thin film has a composite structure in which a nitride phase that includes Zr and Al as nitride constituent elements and at least one metal phase are mixed, wherein the metal phase includes at least one element selected from the group including Cu and Ni, the nitride phase includes a ZrN crystalline phase in which a size of a grain is in the range of 10 nm to 500 nm, and a volume fraction of the ZrN crystalline phase is 10% or more.
    Type: Application
    Filed: January 27, 2016
    Publication date: July 28, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-soo PARK, Keum-hwan PARK, Jin-man PARK, Seok-moo HONG, Sung-ho CHO, Moung-kwan PARK, Jae-won SIM
  • Publication number: 20140345919
    Abstract: A transparent conductor includes a metallic glass, and a method of manufacturing a transparent conductor includes: preparing a metallic glass or a mixture comprising the metallic glass; and firing the metallic glass or the mixture comprising the metallic glass at a predetermined temperature higher than a glass transition temperature of the metallic glass.
    Type: Application
    Filed: December 3, 2013
    Publication date: November 27, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Se Yun KIM, Eun Sung LEE, Keum Hwan PARK, Weon Ho SHIN, Suk Jun KIM, Jin Man PARK, Sang Soo JEE
  • Publication number: 20140312283
    Abstract: According to example embodiments, a metallic glass includes aluminum (Al), a first element group, and a second element group. The first element group includes at least one of a transition metal and a rare earth element. The second element group includes at least one of an alkaline metal, an alkaline-earth metal, a semi-metal, and a non-metal. The second element group and aluminum have an electronegativity difference of greater than or equal to about 0.25. The second element group is included less than or equal to about 3 at % of the metallic glass, based on the total amount of the aluminum (Al), the first element group, and the second element group. A conductive paste and/or an electrode of an electronic device may be formed using the metallic glass.
    Type: Application
    Filed: January 2, 2014
    Publication date: October 23, 2014
    Applicants: Yonsei University, University-Industry Foundation (UIF), SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Man PARK, Keum Hwan PARK, Eun Sung LEE, Suk Jun KIM, Se Yun KIM, Sang Soo JEE, Do-hyang KIM
  • Publication number: 20140070148
    Abstract: According to example embodiments, a conductive powder includes a metallic glass and a coating on the surface of the metallic glass. The coating includes a metal. An article may include a sintered product of the conductive powder. A conductive paste may include the conductive powder. An electronic device may include a sintered product of the conductive paste.
    Type: Application
    Filed: September 11, 2013
    Publication date: March 13, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Suk Jun KIM, Keum Hwan PARK, Eun Sung LEE, Se Yun KIM, Jin Man PARK, Sang Soo JEE