Abstract: A negative differential resistance device includes a dielectric layer having a first surface and a second surface opposing the first surface, a first semiconductor layer that includes a first degenerated layer that is on the first surface of the dielectric layer and has a first polarity, a second semiconductor layer that includes a second degenerated layer that has a region that overlaps the first semiconductor layer and has a second polarity, a first electrode electrically connected to the first semiconductor layer, a second electrode electrically connected to the second semiconductor layer, and a third electrode on the second surface of the dielectric layer and which has a region overlapping at least one of the first semiconductor layer or the second semiconductor layer.

Abstract: A neuron device is described. The neuron device is based on spontaneous polarization switching which includes a plurality of gate electrodes, a plurality of drain electrodes, a plurality of source lines, a dielectric layer, and a semiconductor layer. The gate electrodes are arranged parallel to each other. The drain electrodes are arranged parallel to each other. The source lines are arranged between the gate electrodes and the drain electrodes and parallel to each other. The dielectric layer is formed at intersections between the gate electrodes and the source lines. The semiconductor layer is formed at intersections between the drain electrodes and the source electrodes. The drain electrodes function as synapse-after-neuron linking terminals. The gate electrodes adjust an arrangement direction of electrical dipoles of the dielectric layer to control a firing time point and a firing height of the neuron device.

Abstract: The present invention relates to a heteroaryl derivative compound and a use thereof. Since the heteroaryl derivative of the present invention exhibits excellent inhibitory activity against EGFR, the heteroaryl derivative can be usefully used as a therapeutic agent for EGFR-associated diseases.

Abstract: A negative differential resistance device includes a dielectric layer having a first surface and a second surface opposing the first surface, a first semiconductor layer that includes a first degenerated layer that is on the first surface of the dielectric layer and has a first polarity, a second semiconductor layer that includes a second degenerated layer that has a region that overlaps the first semiconductor layer and has a second polarity, a first electrode electrically connected to the first semiconductor layer, a second electrode electrically connected to the second semiconductor layer, and a third electrode on the second surface of the dielectric layer and which has a region overlapping at least one of the first semiconductor layer or the second semiconductor layer.

Abstract: A photodetector includes a gate electrode extending in a first direction, a ferroelectric layer on the gate electrode and maintaining a state of polarization formed by a gate voltage applied to the gate electrode, a light absorbing layer on the ferroelectric layer and extending in a second direction intersecting the gate electrode, the light absorbing layer including a two-dimensional (2D) material of a layered structure, a source electrode on the ferroelectric layer and connected to a first end of the light absorbing layer, and a drain electrode on the ferroelectric layer and connected to the a second end of the light absorbing layer.

Abstract: A semiconductor device according to an embodiment may include a board, an insulation layer disposed on the board, a threshold voltage control layer disposed on the insulation layer, a first semiconductor layer disposed on the threshold voltage control layer, and a second semiconductor layer disposed on the threshold voltage control layer to cover a portion of the first semiconductor layer. A negative differential resistance device according to an embodiment has an advantageous effect in that the gate voltage enables a peak voltage to be freely controlled within an operation range of the device by forming the threshold voltage control layer.

Abstract: Provided is a negative differential resistance element having a 3-dimension vertical structure. The negative differential resistance element having a 3-dimension vertical structure includes: a substrate; a first electrode that is formed on the substrate to receive a current; a second semiconductor material that is formed in some region of the substrate; a first semiconductor material that is deposited in some other region and the first electrode of the substrate and some region of an upper end of the second semiconductor material; an insulator that has a part vertically erected from the substrate, the other part vertically erected from the second semiconductor material, and an upper portion stacked with a first semiconductor material; and a second electrode that is formed at an upper end of the second semiconductor material to output a current, thereby significantly reducing an area of the device and greatly improving device scaling and integration.

Abstract: A negative differential resistance device includes a dielectric layer having a first surface and a second surface opposing the first surface, a first semiconductor layer that includes a first degenerated layer that is on the first surface of the dielectric layer and has a first polarity, a second semiconductor layer that includes a second degenerated layer that has a region that overlaps the first semiconductor layer and has a second polarity, a first electrode electrically connected to the first semiconductor layer, a second electrode electrically connected to the second semiconductor layer, and a third electrode on the second surface of the dielectric layer and which has a region overlapping at least one of the first semiconductor layer or the second semiconductor layer.

Abstract: A semiconductor device includes at least one trench extending into a semiconductor substrate and lined with a gate dielectric layer; a dipole inducing layer covering a lowermost portion of the lined trench; a gate electrode covering the dipole inducing layer and filled in the lined trench; and doping regions, in the semiconductor substrate, separated from each other by the lined trench and separated from the dipole inducing layer.

Abstract: A semiconductor device according to an embodiment may include a board, an insulation layer disposed on the board, a threshold voltage control layer disposed on the insulation layer, a first semiconductor layer disposed on the threshold voltage control layer, and a second semiconductor layer disposed on the threshold voltage control layer to cover a portion of the first semiconductor layer. A negative differential resistance device according to an embodiment has an advantageous effect in that the gate voltage enables a peak voltage to be freely controlled within an operation range of the device by forming the threshold voltage control layer.

Abstract: Provided is a negative differential resistance element having a 3-dimension vertical structure. The negative differential resistance element having a 3-dimension vertical structure includes: a substrate; a first electrode that is formed on the substrate to receive a current; a second semiconductor material that is formed in some region of the substrate; a first semiconductor material that is deposited in some other region and the first electrode of the substrate and some region of an upper end of the second semiconductor material; an insulator that has a part vertically erected from the substrate, the other part vertically erected from the second semiconductor material, and an upper portion stacked with a first semiconductor material; and a second electrode that is formed at an upper end of the second semiconductor material to output a current, thereby significantly reducing an area of the device and greatly improving device scaling and integration.

Abstract: A neuron device is described. The neuron device is based on spontaneous polarization switching which includes a plurality of gate electrodes, a plurality of drain electrodes, a plurality of source lines, a dielectric layer, and a semiconductor layer. The gate electrodes are arranged parallel to each other. The drain electrodes are arranged parallel to each other. The source lines are arranged between the gate electrodes and the drain electrodes and parallel to each other. The dielectric layer is formed at intersections between the gate electrodes and the source lines. The semiconductor layer is formed at intersections between the drain electrodes and the source electrodes. The drain electrodes function as synapse-after-neuron linking terminals. The gate electrodes adjust an arrangement direction of electrical dipoles of the dielectric layer to control a firing time point and a firing height of the neuron device.

Abstract: A semiconductor device includes at least one trench extending into a semiconductor substrate and lined with a gate dielectric layer; a dipole inducing layer covering a lowermost portion of the lined trench; a gate electrode covering the dipole inducing layer and filled in the lined trench; and doping regions, in the semiconductor substrate, separated from each other by the lined trench and separated from the dipole inducing layer.

Abstract: A neuromorphic device is provided. The neuromorphic device may include a pre-synaptic neuron; a row line extending in a row direction from the pre-synaptic neuron; a post-synaptic neuron; a column line extending in a column direction from the post-synaptic neuron; and a synapse disposed at an intersection between the row line and the column line. The synapse may include a first synapse layer including a plurality of first carbon nano-tubes; a second synapse layer including a plurality of second carbon nano-tubes having different structures from the plurality of first carbon nano-tubes; and a third synapse layer including a plurality of third carbon nano-tubes having different structures from the plurality of first carbon nano-tubes and the plurality of second carbon nano-tubes.

Abstract: A semiconductor device includes at least one trench extending into a semiconductor substrate and lined with a gate dielectric layer; a dipole inducing layer covering a lowermost portion of the lined trench; a gate electrode covering the dipole inducing layer and filled in the lined trench; and doping regions, in the semiconductor substrate, separated from each other by the lined trench and separated from the dipole inducing layer.

Abstract: Apparatuses having variable communication speeds are disclose. In one example, an apparatus may comprise a controller configured to: receive a signal from a host, the signal being compatible with a data communication protocol at a first data communication speed; selectively implement a first data communication protocol from a plurality of data communication protocols to communicate with a first memory or implement a second data communication protocol from the plurality of data communication protocols to communicate with a second memory based on the data communication speed; store data in the first memory via the first data communication protocol when the data communication speed is a first speed; and store data in the second memory via the second data communication protocol when the data communication speed is a second speed that is different than the first speed.

Abstract: A neuromorphic device is provided. The neuromorphic device may include a pre-synaptic neuron; a row line extending in a row direction from the pre-synaptic neuron; a post-synaptic neuron; a column line extending in a column direction from the post-synaptic neuron; and a synapse disposed at an intersection between the row line and the column line. The synapse may include a first synapse layer including a plurality of first carbon nano-tubes; a second synapse layer including a plurality of second carbon nano-tubes having different structures from the plurality of first carbon nano-tubes; and a third synapse layer including a plurality of third carbon nano-tubes having different structures from the plurality of first carbon nano-tubes and the plurality of second carbon nano-tubes.

Abstract: A semiconductor device includes at least one trench extending into a semiconductor substrate and lined with a gate dielectric layer; a dipole inducing layer covering a lowermost portion of the lined trench; a gate electrode covering the dipole inducing layer and filled in the lined trench; and doping regions, in the semiconductor substrate, separated from each other by the lined trench and separated from the dipole inducing layer.

Abstract: Apparatuses having variable communication speeds are disclose. In one example, an apparatus may comprise a controller configured to: receive a signal from a host, the signal being compatible with a data communication protocol at a first data communication speed; selectively implement a first data communication protocol from a plurality of data communication protocols to communicate with a first memory or implement a second data communication protocol from the plurality of data communication protocols to communicate with a second memory based on the data communication speed; store data in the first memory via the first data communication protocol when the data communication speed is a first speed; and store data in the second memory via the second data communication protocol when the data communication speed is a second speed that is different than the first speed.

Abstract: Apparatuses having variable communication speeds are disclose. In one example, an apparatus may comprise a controller configured to: receive a signal from a host, the signal being compatible with a data communication protocol at a first data communication speed; selectively implement a first data communication protocol from a plurality of data communication protocols to communicate with a first memory or implement a second data communication protocol from the plurality of data communication protocols to communicate with a second memory based on the data communication speed; store data in the first memory via the first data communication protocol when the data communication speed is a first speed; and store data in the second memory via the second data communication protocol when the data communication speed is a second speed that is different than the first speed.