Patents by Inventor Keun-hong Ryoo

Keun-hong Ryoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer transfer blade
    Patent number: 5755469
    Abstract: A wafer transfer blade in a wafer transfer arm employed for a semiconductor device manufacturing process, includes a flat region whereon a wafer is loaded; and an end region being integral with the flat region and having a rounded side surface so as to deflect impact on the wafer when colliding with the transfer blade, to thereby reduce wafer edge chipping.
    Type: Grant
    Filed: July 11, 1995
    Date of Patent: May 26, 1998
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun-yong Choi, Keun-hong Ryoo, Jin-ho Park