Patents by Inventor Keun-Il Lee

Keun-Il Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119949
    Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 11, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Jeong Il SEO, Seung Kwon BEACK, Dae Young JANG, Kyeong Ok KANG, Tae Jin PARK, Yong Ju LEE, Keun Woo CHOI, Jin Woong KIM
  • Patent number: 11952490
    Abstract: The present disclosure relates to a polycarbonate resin composition, and more particularly, to a polycarbonate resin composition containing 90 wt % to 99 wt % of a polycarbonate resin, 0.3 wt % to 0.7 wt % of an anthraquinone-based black dye, and 0.2 wt % to 1.0 wt % of an acrylic polymeric chain extender, and a molded article containing the same.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: April 9, 2024
    Assignees: HYUNDAI MOBIS CO., LTD., LG CHEM, LTD.
    Inventors: Hyoung Taek Kang, Keun Hyung Lee, Young Min Kim, Moo Seok Lee, Myeung Il Kim, Jae Chan Park
  • Patent number: 6723601
    Abstract: A semiconductor device for use in a memory cell including an active matrix provided with a silicon substrate, at least one transistor formed on the silicon substrate, a number of bottom electrodes formed over the transistors, a plurality of conductive plugs to electrically connect the bottom electrodes to the transistors, respectively, and an insulating layer formed around the conductive plugs. In the device, by carrying out a carbon treatment to top surface portions of the bottom electrode structure, it is possible to secure enough space to prevent the formation of bridges between the bottom electrodes.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: April 20, 2004
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Se-Min Lee, Dong-Hwan Kim, Keun-Il Lee
  • Publication number: 20030089939
    Abstract: A semiconductor device for use in a memory cell including an active matrix provided with a silicon substrate, at least one transistor formed on the silicon substrate, a number of bottom electrodes formed over the transistors, a plurality of conductive plugs to electrically connect the bottom electrodes to the transistors, respectively, and an insulating layer formed around the conductive plugs. In the device, by carrying out a carbon treatment to top surface portions of the bottom electrode structure, it is possible to secure enough space to prevent the formation of bridges between the bottom electrodes.
    Type: Application
    Filed: December 18, 2002
    Publication date: May 15, 2003
    Applicant: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
    Inventors: Se-Min Lee, Dong-Hwan Kim, Keun-Il Lee
  • Patent number: 6518612
    Abstract: A semiconductor device for use in a memory cell including an active matrix provided with a silicon substrate, at least one transistor formed on the silicon substrate, a number of bottom electrodes formed over the transistors, a plurality of conductive plugs to electrically connect the bottom electrodes to the transistors, respectively, and an insulating layer formed around the conductive plugs. In the device, by carrying out a carbon treatment to top surface portions of the bottom electrode structure, it is possible to secure enough space to prevent the formation of bridges between the bottom electrodes.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: February 11, 2003
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Se-Min Lee, Dong-Hwan Kim, Keun-Il Lee
  • Publication number: 20010023102
    Abstract: A semiconductor device for use in a memory cell including an active matrix provided with a silicon substrate, at least one transistor formed on the silicon substrate, a number of bottom electrodes formed over the transistors, a plurality of conductive plugs to electrically connect the bottom electrodes to the transistors, respectively, and an insulating layer formed around the conductive plugs. In the device, by carrying out a carbon treatment to top surface portions of the bottom electrode structure, it is possible to secure enough space to prevent the formation of bridges between the bottom electrodes.
    Type: Application
    Filed: December 20, 2000
    Publication date: September 20, 2001
    Inventors: Se-Min Lee, Dong-Hwan Kim, Keun-Il Lee