Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: Disclosed is a method for forming patterns that can improve line width roughness (LWR) by forming a first resist material on an etch target layer, forming a second resist material including a light-shielding portion and a light-transmitting portion on the first resist material, exposing the first resist material using the light-shielding portion of the second resist material as an exposure mask, removing the second resist material, forming a first resist pattern by developing the exposed first resist material, and etching the etch target layer using the first resist pattern as an etch barrier.

Abstract: Disclosed is a method for forming patterns that can improve line width roughness (LWR) by forming a first resist material on an etch target layer, forming a second resist material including a light-shielding portion and a light-transmitting portion on the first resist material, exposing the first resist material using the light-shielding portion of the second resist material as an exposure mask, removing the second resist material, forming a first resist pattern by developing the exposed first resist material, and etching the etch target layer using the first resist pattern as an etch barrier.

Abstract: This technology provides an electronic device. An electronic device in accordance with an implementation of this document includes a semiconductor memory, and the semiconductor memory may include a substrate; a plurality of structures formed over the substrate to be spaced apart from each other, each structure comprising a free layer having a variable magnetization direction, a pinned layer having a pinned magnetization direction, and a tunnel barrier layer interposed between the free layer and the pinned layer; and a magnetic correction layer formed adjacent to the plurality of structures and structured to reduce an influence to the free layer by a stray magnetic field generated by the pinned layer.

Abstract: This technology provides an electronic device. An electronic device in accordance with an implementation of this document includes a semiconductor memory, and the semiconductor memory may include a substrate; a plurality of structures formed over the substrate to be spaced apart from each other, each structure comprising a free layer having a variable magnetization direction, a pinned layer having a pinned magnetization direction, and a tunnel barrier layer interposed between the free layer and the pinned layer; and a magnetic correction layer formed adjacent to the plurality of structures and structured to reduce an influence to the free layer by a stray magnetic field generated by the pinned layer.

Abstract: A metal suicide layer is fabricated in a semiconductor device. A first metal layer is deposited on a silicon substrate formed with an S interlayer dielectric having a contact hole through PVD. A second metal layer is deposited on the first metal layer through any one of CVD and ALD. Annealing is performed on the silicon substrate which is formed with the first and second metal layers to form the metal silicide. The portions of the second metal layer and the first metal layer which have not reacted during annealing are removed.