Abstract: Provided is a MEMS acoustic sensor including a substrate and a cavity, a back plate supported on the substrate and including a plurality of through-holes, at least one anchor projecting from the back plate toward the substrate, and a diaphragm supported by the at least one anchor and deformed by a sound wave introducing from the outside through the cavity, wherein no part of the deformed diaphragm comes into contact with the substrate.

Abstract: Provided is a MEMS acoustic sensor including a substrate and a cavity, a back plate supported on the substrate and including a plurality of through-holes, at least one anchor projecting from the back plate toward the substrate, and a diaphragm supported by the at least one anchor and deformed by a sound wave introducing from the outside through the cavity, wherein no part of the deformed diaphragm comes into contact with the substrate.

Abstract: Fingerprint sensing technology of a fingerprint sensor for authenticating whether a fingerprint of a subject is forged or falsified by using a waveform reflected from the subject, such as an ultrasonic wave. The fingerprint authentication apparatus includes a fingerprint sensor configured to apply a wave signal to a subject and receive a wave signal reflected from the subject, a local waveform detector configured to detect local waveforms by dividing the received wave signal by a reception time, and a forgery detection unit configured to count the number of local waveforms and detect whether a fingerprint provided from the subject is forged or not based on the counted number of local waveforms.

Abstract: The MEMS sensor includes: a device substrate on which a device pattern is formed; a cap substrate disposed on top of the device substrate, the cap substrate comprising a first cavity area; a base substrate disposed on the bottom of the device substrate; a first-through silicon via formed through the base substrate, the first-through silicon via including a first core area for outputting an electrical signal provided from the device pattern to the outside or transmitting an electrical signal provided from the outside to the device pattern, a first insulating area surrounding an outer surface of the first core area, a first peripheral area surrounding an outer surface of the first insulating area, and a second insulating area surrounding an outer surface of the first peripheral area; and a circuit board, electrically connected to the first-through silicon via, for processing electrical signals for the device pattern.

Abstract: The present invention relates to a MEMS-based three-axis acceleration sensor and, more specifically, comprises: an x-axis sensor mass sensing an external acceleration inputted in the direction of a first axis parallel to a bottom wafer substrate; a y-axis sensor mass sensing an external acceleration inputted in the direction of a second axis parallel to the bottom wafer substrate and perpendicular to the first axis; and a z-axis sensor mass formed so as to encompass the x-axis sensor mass and the y-axis sensor mass and sensing an external acceleration inputted in the direction of a third axis perpendicular to the bottom wafer substrate, wherein space is saved and accelerations in the three axis directions are respectively measured by sensing the independent movement of each axis sensor mass.

Abstract: The present disclosure relates to fingerprint sensing technology of a fingerprint sensor to be used, and more particularly to an apparatus for authenticating whether a fingerprint of a subject is forged or falsified by using a waveform reflected from the subject, such as an ultrasonic wave. The fingerprint authentication apparatus includes a fingerprint sensor configured to apply a wave signal to a subject and receive a wave signal reflected from the subject, a local waveform detector configured to detect local waveforms by dividing the received wave signal by a reception time, and a forgery detection unit configured to count the number of local waveforms and detect whether a fingerprint provided from the subject is forged or not based on the counted number of local waveforms.

Abstract: Provided is a semiconductor package. The semiconductor package comprises: a device substrate having a device pattern formed thereon; a cap substrate overlying the device substrate and comprising a first cavity area; a base substrate underlying the device substrate and comprising a second cavity area formed in the position corresponding to the first cavity area and at least one first through-silicon via that outputs, to the outside, an electrical signal provided from the device pattern or transmits, to the device pattern, an electrical signal provided from the outside; and a circuit substrate underlying the base substrate and electrically connected with the first through-silicon via to process an electrical signal for the device pattern.

Abstract: A MEMS gyroscope including: a frame arranged parallel to a bottom wafer substrate; a sensor mass body excited at one degree of freedom in an excitation mode, and of which the displacement is sensed at two degrees of freedom by a Coriolis force in a sensing mode when an external angular velocity is input to the frame; and at least two sensing electrode for sensing a displacement of the sensor mass body, the displacement being sensed at the two degrees of freedom, wherein the sensor mass body comprises an inner mass body and an outer mass body surrounding the inner mass body, the outer mass body and the frame are connected by a first support spring, and the outer mass body and the inner mass body are connected by a second support spring.

Abstract: A MEMS-based gyroscope including: a sensor frame disposed parallel to a bottom wafer substrate; a sensor mass body which relatively moves to the sensor frame, and is excited at one degree of freedom in an excitation mode; and at least one sensing electrode which senses displacement of the sensor mass body at the one degree of freedom in a sensing mode by Coriolis force, when an external angular velocity is input to the sensor mass body, wherein the sensor mass body includes two mass units, the two mass units are arranged in line symmetry with each other, and the antiphase motion of the two mass units is maintained by an antiphase link mechanism directly or indirectly connected between the two mass units.

Abstract: Provided is a MEMS anti-phase link mechanism for ensuring anti-phase movements of two axisymmetric mass body units forming a sensor mass body, in a MEMS-based gyroscope including: a frame disposed to be parallel to a bottom wafer substrate; the sensor mass body in which displacement is sensed by Coriolis force when a movement in an excitation direction and an external angular velocity are input to the frame; and at least one sensing electrode which senses the displacement of the sensor mass body. The MEMS anti-phase link mechanism includes at least two anchor connecting parts connected to an immovable central anchor; and at least two link arms which are connected to the at least two anchor connecting parts, and are connected to the two mass body units in a 180-degree rotational symmetry with each other on the basis of the center of the MEMS anti-phase link mechanism.