Patents by Inventor Keun-kyuk Lee

Keun-kyuk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8766419
    Abstract: Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: July 1, 2014
    Assignee: Fairchild Korea Semiconductor, Ltd.
    Inventors: Seung-won Lim, O-Seob Jeon, Joon-seo Son, Keun-kyuk Lee, Yun-hwa Choi
  • Publication number: 20100155914
    Abstract: Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.
    Type: Application
    Filed: December 21, 2009
    Publication date: June 24, 2010
    Inventors: Seung-won Lim, O-Seob Jeon, Joon-seo Son, Keun-kyuk Lee, Yun-hwa Choi