Patents by Inventor Keun-Ru Chuang

Keun-Ru Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT EMITTING DIODE HAVING A TRANSPARENT SUBSTRATE
    Publication number: 20110220873
    Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
    Type: Application
    Filed: May 24, 2011
    Publication date: September 15, 2011
    Applicant: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Keun-Ru Chuang, Shane-Shyan Wey, Chih-Chiang Lu, Ming-Jiunn Jou, Shu-Wen Sung, Chia-Cheng Liu, Chao-Nien Huang
  • Method for manufacturing a light emitting diode having a transparent substrate
    Patent number: 6972208
    Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: December 6, 2005
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Keun-Ru Chuang, Shane-Shyan Wey, Chih-Chiang Lu, Ming-Jiunn Jou, Shu-Wen Sung, Chia-Cheng Liu, Chao-Nien Huang
  • Light emitting diode having a transparent substrate
    Patent number: 6867426
    Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
    Type: Grant
    Filed: March 6, 2002
    Date of Patent: March 15, 2005
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Keun-Ru Chuang, Shane-Shyan Wey, Chih-Chiang Lu, Ming-Jiunn Jou, Shu-Wen Sung, Chia-Cheng Liu, Chao-Nien Huang
  • LIGHT EMITTING DIODE HAVING A TRANSPARENT SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME
    Publication number: 20040197981
    Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
    Type: Application
    Filed: May 21, 2004
    Publication date: October 7, 2004
    Inventors: Min-Hsun Hsieh, Keun-Ru Chuang, Shane-Shyan Wey, Chih-Chiang Lu, Ming-Jiunn Jou, Shu-Wen Sung, Chia-Cheng Liu, Chao-Nien Huang
  • Light emitting diode having a transparent substrate and a method for manufacturing the same
    Publication number: 20030003613
    Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
    Type: Application
    Filed: March 6, 2002
    Publication date: January 2, 2003
    Inventors: Min-Hsun Hsieh, Keun-Ru Chuang, Shane-Shyan Wey, Chih-Chiang Lu, Ming-Jiunn Jou, Shu-Wen Sung, Chia-Cheng Liu, Chao-Nien Huang