Patents by Inventor Keunmyung Lee

Keunmyung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160254300
    Abstract: a sensor system for a dual-aperture camera. The sensitivity of infrared (IR) light may be increased in order to reduce the noise of an image. For example, the size of an infrared pixel may be increased with respect to visible light pixels. For example, an infrared pixel may be stacked below a visible light pixel or pixels. For example, a separate infrared pixel may be provided as a second source of infrared light.
    Type: Application
    Filed: December 1, 2015
    Publication date: September 1, 2016
    Applicant: DUAL APERTURE INTERNATIONAL CO., LTD.
    Inventors: Andrew Wajs, David Lee, Keunmyung Lee, Haeseung Lee, Jongho Park
  • Publication number: 20090195483
    Abstract: A plurality of gray level versus OLED current curves are generated by measuring many OLED panels from a stable manufacturing process, and those curves are stored as standard gray level versus OLED current curves. When a new OLED display is manufactured from the process, each of its sub-pixels is characterized as having the characteristics of one of the pre-generated standard gray level versus OLED current curves, based on a gray level versus OLED current measurement at a single gray level. This drastically reduces the time it takes to determine the TFT gate voltage versus OLED current characteristics of the sub-pixels in the OLED display. The OLED display can use the selected one of the pre-generated standard gray level versus OLED current curves to correct non-uniformities of the sub-pixels in the OLED display caused by non-uniform TFTs in the active matrix.
    Type: Application
    Filed: February 6, 2008
    Publication date: August 6, 2009
    Applicant: LEADIS TECHNOLOGY, INC.
    Inventors: Walter Edward Naugler, JR., Keunmyung Lee, Jose Ignacio Arreola
  • Patent number: 7068248
    Abstract: A single-chip column driver for organic light emitting diode (OLED) display is disclosed. Instead of using two column drivers for dual scan, the present invention uses one column driver driving both the upper and the lower OLED panels. The column driver has a two set of output circuitry: one for driving the upper panel and the other for driving the lower panel. The single chip solution of the present invention eliminates the problem of display uniformity without increasing the part count. The invention also enables independent control of RGB without further increasing the part count.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: June 27, 2006
    Assignee: Leadis Technology, Inc.
    Inventors: Sung Tae Ahn, Keunmyung Lee, Dae Young Ahn, Tae Kwang Park
  • Patent number: 7046222
    Abstract: A single scan driver for an organic light emitting diode (OLED) display is disclosed, that can reduce the required power consumption. By connecting together both ends of each column line so that a single driver circuit can drive both ends of each column line together, the column line resistance is reduced, resulting in a significant reduction in power consumption.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: May 16, 2006
    Assignee: Leadis Technology, Inc.
    Inventors: Chang Oon Kim, Keunmyung Lee
  • Patent number: 7015889
    Abstract: A scheme to reduce output variations in a column driver for a flat-panel display by sharing the characteristics of analog circuit is disclosed. An input multiplexer is provided between two neighboring digital inputs, and an output multiplexer is provided between two neighboring analog outputs so that the characteristics of neighboring analog circuits can be shared by multiplexing. The averaging effect by sharing reduces variations in the output. The multiplexing may be done either in time division or on a frame-by-frame basis.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: March 21, 2006
    Assignee: Leadis Technology, Inc.
    Inventors: Sung Tae Ahn, Yung Jin Jeon, Chan Young Jeong, Keunmyung Lee
  • Patent number: 6919872
    Abstract: A driver for driving an STN LCD is disclosed. A preferred embodiment comprises a 3-line output display data for storing display data, an XOR block for finding mismatches between each 3-line output set of the stored display and orthogonal function signals, a decoder block for calculating mismatch numbers, a level shifter block for shifting the data level of the mismatch numbers to another level, and a voltage selector block for selecting a voltage level from 2 levels of voltage. Because data latches and output latches are not necessary, the driver of the present invention achieves significant reduction in the circuit components and chip size without compromising the display quality.
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: July 19, 2005
    Assignee: Leadis Technology, Inc.
    Inventors: Tae-Kwang Park, Keunmyung Lee
  • Patent number: 6584149
    Abstract: A signal equalization system provides a block-mode equalization system for digital equalization in computer and networking systems in which a “1” bit pulse is followed by a significant negative bit and less significant negative bit pulses as a multiple groups with a lower bit rate. The magnitude of the grouped bit pulses, or blocks of equalization bit pulses, can be the average value of the individual bits to produce a clean output waveform. Since the block compensates for the lower frequency response of the channel, its effectiveness is not sensitive to the exact location of the pulses. This makes it possible to align the blocks in wide pulses having decreasing magnitudes and increasing durations. This further means that when data multiplexing is involved in driver circuitry for the signal transmitter, the block can be generated from a lower frequency clocked domain before the multiplexing without burdening the high frequency side of the driver circuitry.
    Type: Grant
    Filed: October 7, 1999
    Date of Patent: June 24, 2003
    Assignee: Hewlett-Packard Development Company L.P.P.
    Inventor: Keunmyung Lee
  • Publication number: 20030112207
    Abstract: A single scan driver for an organic light emitting diode (OLED) display is disclosed, that can reduce the required power consumption. By connecting together both ends of each column line so that a single driver circuit can drive both ends of each column line together, the column line resistance is reduced, resulting a significant reduction in power consumption.
    Type: Application
    Filed: August 30, 2002
    Publication date: June 19, 2003
    Inventors: Chang Oon Kim, Keunmyung Lee
  • Patent number: 6566924
    Abstract: A system and method is provided for controlling clock skew to meet timing constraints for a semiconductor integrated circuit. On-chip self-tuning circuits can be connected to each latch in the integrated circuit for controlling clock skew. Each self-tuning circuit delays a clock signal that is input to a latch when the clock skew does not satisfy the timing constraint for that latch. The self-tuning circuit repeatedly delays the clock signal until the clock skew is satisfied or until the delay becomes greater than or equal to a predetermined threshold. The delayed clock signal is then pushed to other latches in the integrated circuit until all the timing constraints for the integrated circuit are satisfied.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: May 20, 2003
    Assignee: Hewlett-Packard Development Company L.P.
    Inventors: Shen Lin, Norman Chang, Keunmyung Lee, Osamu Nakagawa, Weize Xie
  • Publication number: 20030058203
    Abstract: A single-chip column driver for organic light emitting diode (OLED) display is disclosed. Instead of using two column drivers for dual scan, the present invention uses one column driver driving both the upper and the lower OLED panels. The column driver has a two set of output circuitry: one for driving the upper panel and the other for driving the lower panel. The single chip solution of the present invention eliminates the problem of display uniformity without increasing the part count. The invention also enables independent control of RGB without further increasing the part count.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 27, 2003
    Inventors: Sung Tae Ahn, Keunmyung Lee, Dae Young Ahn, Tae Kwang Park
  • Publication number: 20030058233
    Abstract: A scheme to reduce output variations in a column driver for a flat-panel display by sharing the characteristics of analog circuit is disclosed. An input multiplexer is provided between two neighboring digital inputs, and an output multiplexer is provided between two neighboring analog outputs so that the characteristics of neighboring analog circuits can be shared by multiplexing. The averaging effect by sharing reduces variations in the output. The multiplexing may be done either in time division or on a frame-by-frame basis.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 27, 2003
    Inventors: Sung Tae Ahn, Yung Jin Jeon, Chen Young Jeong, Keunmyung Lee
  • Publication number: 20030020527
    Abstract: A system and method is provided for controlling clock skew to meet timing constraints for a semiconductor integrated circuit. On-chip self-tuning circuits can be connected to each latch in the integrated circuit for controlling clock skew. Each self-tuning circuit delays a clock signal that is input to a latch when the clock skew does not satisfy the timing constraint for that latch. The self-tuning circuit repeatedly delays the clock signal until the clock skew is satisfied or until the delay becomes greater than or equal to a predetermined threshold. The delayed clock signal is then pushed to other latches in the integrated circuit until all the timing constraints for the integrated circuit are satisfied.
    Type: Application
    Filed: July 25, 2001
    Publication date: January 30, 2003
    Inventors: Shen Lin, Norman Chang, Keunmyung Lee, Osamu Nakagawa, Weize Xie
  • Patent number: 5966293
    Abstract: An electrical interconnection structure. The electrical interconnection structure includes a mother board substrate having a plurality of layers. At least one layer includes a signal path having a characteristic impedance of Z.sub.O and a conductive ground plane. A signal via passes through each layer of the mother board substrate. The signal via electrically is connected to the signal path. A ground via passes through each layer of the mother board substrate. The ground via is electrically connected to the conductive ground plane. The electrical interconnection structure further includes a plurality of flex circuits. Each flex circuit includes a flex signal path having a characteristic impedance of Z.sub.O and a flex ground plane. Each flex signal path is electrically connected to the signal via and each flex ground plane is electrically connected to the ground via.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: October 12, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Hannsjorg Obermaier, Keunmyung Lee
  • Patent number: 5610833
    Abstract: Data processing methods and computer display systems for computer aided design and electrical performance prediction of multilevel on-chip and off-chip interconnects. The invention specifically relates to parameterized graphical display and computation tools for calculation and display of capacitance and other electrical characteristics of multilevel VLSI, PCB, and MCM interconnects. Four subsystems are integrated: (a) a batch-mode computation module that combines a 2-D/3-D finite difference numerical simulation and a fast interpolation algorithm; (b) an interactive design mode with performance browsing, goal-directed synthesis, and on-line performance evaluation; (c) an interactive SPICE subcircuit generator and simulator; and (d) a spreadsheet-style graphical user interface.
    Type: Grant
    Filed: September 25, 1995
    Date of Patent: March 11, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Norman H. Chang, Keh-Jeng Chang, Keunmyung Lee, Soo-Young Oh
  • Patent number: 4812419
    Abstract: A via connection and method for making the same for integrated circuits having multiple layers of electrically conductive interconnect lines separated by an insulative layer. The via connection is characterized by a very thin layer of high resistivity material lining the via hole in conductive contact with interconnect lines in two layers. The resistivity of the thin layer material is in a range from about 10 to about 50 times the interconnect line resistivities and generally has a thickness of less than 100 nanometers. The thin layer assures more uniform current flow in the via connection thereby preventing electromigration, with reduced peak local current density by causing current to swing more widely around the corner at the interface between the interconnect lines at the via.
    Type: Grant
    Filed: April 30, 1987
    Date of Patent: March 14, 1989
    Assignee: Hewlett-Packard Company
    Inventors: Keunmyung Lee, Yoshio Nishi