Patents by Inventor Kevie Dowhower

Kevie Dowhower has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor light emitting element formed on a clear or translucent substrate
    Patent number: 6730530
    Abstract: This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: May 4, 2004
    Assignee: Luminary Logic Ltd
    Inventors: Michelle Jillian Fuwausa, Kevie Dowhower
  • Semiconductor light emitting element formed on a clear or translucent substrate
    Publication number: 20030071270
    Abstract: This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.
    Type: Application
    Filed: November 25, 2002
    Publication date: April 17, 2003
    Inventors: Michelle Jillian Fuwausa, Kevie Dowhower
  • Semiconductor light emitting element formed on a clear or translucent substrate
    Patent number: 6486561
    Abstract: This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.
    Type: Grant
    Filed: September 12, 2000
    Date of Patent: November 26, 2002
    Assignee: Luminary Logic, Ltd.
    Inventors: Michelle Jillian Fuwausa, Kevie Dowhower