Patents by Inventor Kevien J. Negus

Kevien J. Negus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic package for high frequency semiconductor devices
    Patent number: 4839717
    Abstract: A ceramic semiconductor package suitable for high frequency operation includes internal and external ground planes formed on opposite faces of a ceramic base member. The internal ground plane is connected to a ground ring formed on the packaged semiconductor device, and both ground planes are interconnected about the periphery of the package. In this way, a uniform and continuous ground is provided to minimize variations in signal transmission line impedance.
    Type: Grant
    Filed: June 7, 1988
    Date of Patent: June 13, 1989
    Assignee: Fairchild Semiconductor Corporation
    Inventors: William S. Phy, James M. Early, Kevien J. Negus