Abstract: Mounting assemblies for waste disposers such as food waste disposers, waste disposers employing such mounting assemblies, and related methods are disclosed herein. Mounting assemblies include an engagement feature having a first engagement structure located on the body flange and a second engagement structure located on the upper portion of the disposer body. When the engagement feature is in the engaged position, the body flange and the disposer body are engaged, forming a combined disposer and body flange assembly. The combined disposer and body flange assembly can be lifted into alignment with the strainer flange assembly and rotated as a unit to engage the body flange with the mounting flange.

Abstract: This invention discloses a method of manufacturing a desired metal part which comprises (1) providing an powder metal sinterbraze hard steel component and a wrought steel stamping component; (2) affixing the powder metal hard steel component and the wrought steel stamping component together with a brazing filler metal being alloyed at the interface between the powder metal hard steel component and the wrought steel stamping component; (3) sinter brazing the powder metal hard steel component and the wrought steel stamping component together to produce an in-process metal part; and (4) tempering the in-process metal part to produce the desired metal part.

Abstract: It has been found that high density articles having improved strength, corrosion resistance, better durability, and decent magnetic characteristics can be manufactured from a ferritic stainless steel powder using a novel method. This technique is especially beneficial in manufacturing parts, such as, reluctor rings, tone wheels, trigger wheels, pump impeller blades, and EGR valves, in large quantities. This method involves (1) compacting the ferritic stainless steel powder in a mold into a green article, (2) sintering the green article at an elevated temperature under vacuum or a reducing atmosphere to produce a sintered article, and (3) forging the sintered article under a reducing or an inert gas atmosphere to a density of greater than 7.5 g/cc in the presence of a graphite free lubricant to produce the high density article.

Abstract: A system and method for the randomization of packet headers is disclosed. A controller is used to provide random values, also referred to as nonces, that replace the source and destination addresses that typically appear in a packet header. The controller also provides routing rules to the switches and routers in the network that allow these devices to properly route packets, even though the source and destination addresses are not present. In some embodiments, network devices that support software-defined networking (SDN) are employed. The number of times that a particular nonce is used may be variable. In some embodiments, a nonce is used for exactly one packet header. In this way, packets may traverse a network using nonces in place of actual source and destination addresses. Because the nonces are changed periodically, detection of traffic patterns is made significantly more difficult.

Abstract: A system and method for the randomization of packet headers is disclosed. A controller is used to provide random values, also referred to as nonces, that replace the source and destination addresses that typically appear in a packet header. The controller also provides routing rules to the switches and routers in the network that allow these devices to properly route packets, even though the source and destination addresses are not present. In some embodiments, network devices that support software-defined networking (SDN) are employed. The number of times that a particular nonce is used may be variable. In some embodiments, a nonce is used for exactly one packet header. In this way, packets may traverse a network using nonces in place of actual source and destination addresses. Because the nonces are changed periodically, detection of traffic patterns is made significantly more difficult.

Abstract: A structure in a substrate for the manufacturing of a semiconductor device, wherein a first material and at least one second material are to be etched by at least one etching medium, wherein the at least one second material has a higher etch rate for the at least one etching medium relative to the first material. The at least one second material occupies a space which is at least at one side adjacent to the first material so that an additional etching access to the first material is prepared when at least one etching medium etches the first and the second material.

Abstract: A computer implemented method, an apparatus, and a computer usable program product are provided for configuring and modeling server connection and deployment information in an enterprise tooling environment. A software model is provided that comprises a connections object, which includes a plurality of connection objects and deploy spec objects. Each of the connection objects is specific to a backend server type. A deploy controller is provided at run time to examine the connections object for a connection object. A backend resource manager is loaded for a specific application server. If a connection object is present, the backend resource manager loads a connection interpreter, which transforms development time connection information in the connection object to the run time connection information in corresponding deploy spec object and connection factory spec object. The backend resource manager then writes the deployment information to the configurations files of the application server.