Abstract: Waveguide filters having a laminated dielectric structure for resonating at a predetermined frequency and having a series of longitudinally spaced resonators. A selected plural number of individual layers of high dielectric low temperature co-fired ceramic are laminated into a monolithic structure and then plated with a conductive material. Each of the individual layers is dimensioned and the number of layers is selected so that the unit resonates at the predetermined frequency. A waveguide filter is also described where a select plural number of contiguous layers of low temperature co-fired ceramic are laminated and plated with a conductive material. A series of vertically placed vias are positioned so as to form a perimeter of a waveguide filter. A plurality of individual layers of low temperature co-fired ceramic are laminated to the monolithic structure to form a laminated unit so that electrical components and the waveguide filter can be integrated into a single package.

Abstract: A packaging system for a standard electronic module is provided utilizing a multi-layer, low temperature, co-fired ceramic motherboard. Device packages, such as an RF device package, are formed of low temperature, low dielectric, co-fired ceramic materials. The device packages are mounted on a composite heat sink provide on one side of the motherboard. A pressure plate provide on the opposite side of the motherboard is fastened to the heat sink to compress the device package. Pressure contact interconnects are used to make contacts between the device packages and the particular conductor layer in the multilayer motherboard. The radio frequency conductor layer in the motherboard is isolated from power and control layers by ground planes provided in the motherboard.