Patents by Inventor Kevin A. Papke
Kevin A. Papke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11810766Abstract: Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20° C. to about 300° C. during use of the process chamber. The protective multilayer coating comprises a bond layer and a top layer, the bond layer is formed on a chamber component to reduce the stress between the top layer and the chamber component. The reduced stress decreases or prevents particle shedding from the top layer of the multilayer coating during and after use of the process chamber. The bond layer comprises titanium, titanium nitride, aluminum, or combinations thereof, and the top layer comprises tungsten nitride.Type: GrantFiled: May 2, 2019Date of Patent: November 7, 2023Assignee: Applied Materials, Inc.Inventors: Karthikeyan Balaraman, Sathyanarayana Bindiganavale, Rajasekhar Patibandla, Balamurugan Ramasamy, Kartik Shah, Umesh M. Kelkar, Mats Larsson, Kevin A. Papke, William M. Lu
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Publication number: 20230167543Abstract: One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz.Type: ApplicationFiled: January 26, 2023Publication date: June 1, 2023Inventors: Mats LARSSON, Kevin A. PAPKE, Chirag Shaileshbhai KHAIRNAR, Rajasekhar PATIBANDLA, Karthikeyan BALARAMAN, Balamurugan RAMASAMY, Kartik SHAH, Umesh M. KELKAR
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Patent number: 11591689Abstract: One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz.Type: GrantFiled: February 14, 2020Date of Patent: February 28, 2023Assignee: Applied Materials, Inc.Inventors: Mats Larsson, Kevin A. Papke, Chirag Shaileshbhai Khairnar, Rajasekhar Patibandla, Karthikeyan Balaraman, Balamurugan Ramasamy, Kartik Shah, Umesh M. Kelkar
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Publication number: 20220277936Abstract: The present disclosure relates to protective multilayer coatings for processing clumbers and processing clumber components. In one embodiment, a multilayer protean e coating includes a metal nitride layer and an oxide layer disposed thereon. In one embodiment, the multilayer protective coating further includes an oxynitride interlayer and/or an oxy fluoride layer. The multilayer protective coating may be formed on a metal alloy or ceramic substrate, such as a processing clumber or a processing clumber component used in tire field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, the metal nitride layer and the oxide layer are deposited on the substrate by atomic layer deposition.Type: ApplicationFiled: June 22, 2020Publication date: September 1, 2022Inventors: Geetika BAJAJ, Yogita PAREEK, Darshan THAKARE, Prerna Sonthalia GORADIA, Ankur KADAM, Kevin A. PAPKE
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Patent number: 11239058Abstract: Embodiments of the present disclosure provide protective coatings, i.e., diffusion and thermal barrier coatings, for aluminum alloy substrates. In particular, embodiments described herein provide a protective layer stack comprising a tantalum nitride layer disposed on an aluminum alloy substrate and a ceramic layer disposed on the tantalum nitride layer. In some embodiments, the aluminum alloy substrates comprise processing chambers and processing chamber components used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, an article includes a substrate, a tantalum nitride layer disposed on the substrate, and a ceramic layer disposed on the tantalum nitride layer.Type: GrantFiled: May 14, 2019Date of Patent: February 1, 2022Assignee: Applied Materials, Inc.Inventors: Karthikeyan Balaraman, Balamurugan Ramasamy, Kartik Shah, Mats Larsson, Kevin A. Papke, Rajasekhar Patibandla, Sathyanarayana Bindiganavale, Umesh M. Kelkar
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Patent number: 11118263Abstract: A method of forming a protective coating film for halide plasma resistance includes depositing a seed layer on a surface of an article via an atomic layer deposition (ALD) process, depositing a rare-earth containing oxide layer on the seed layer via an ALD process, and exposing the rare-earth containing oxide layer to fluorine-containing plasma.Type: GrantFiled: May 10, 2019Date of Patent: September 14, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Yogita Pareek, Kevin A. Papke, Emily Sierra Thomson, Mahmut Sami Kavrik, Andrew C. Kummel
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Patent number: 11047035Abstract: Disclosed herein is a poly-crystalline protective coating on a surface of a chamber component. The poly-crystalline protective coating may be deposited by thermal spraying and may comprise cubic yttria and monoclinic yttria. At least one of: (1) the ratio of the cubic yttria to monoclinic yttria, (2) the crystallite size of at least one of the cubic yttria or the monoclinic yttria, (3) the atomic ratio of oxygen (O) to yttria (Y), and/or (4) the dielectric properties of the poly-crystalline protective coating may be controlled to obtain consistent chamber performance when switching coated chamber components within a chamber of interest.Type: GrantFiled: February 12, 2019Date of Patent: June 29, 2021Assignee: Applied Materials, Inc.Inventors: Ramesh Gopalan, Yixing Lin, Tasnuva Tabassum, Siamak Salimian, Yikai Chen, Kevin Papke
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Patent number: 10941303Abstract: Embodiments of the disclosure provide a chamber component for use in a plasma processing chamber apparatus. The chamber component may include a coating layer that provides a fluorine-rich surface. In one embodiment, a chamber component, for use in a plasma processing apparatus, includes a body having an outer layer comprising yttria having a coating layer formed thereon, wherein the coating layer comprises a yttrium fluoride containing material.Type: GrantFiled: October 13, 2017Date of Patent: March 9, 2021Assignee: Applied Materials, Inc.Inventors: Mats Larsson, Yogita Pareek, Jianqi Wang, Kevin A. Papke
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Patent number: 10921251Abstract: The present invention generally relates method and part wear indicator for identifying an eroded chamber component in an etching or other plasma processing chamber. In one embodiment, a chamber component has a part wear indicator. The chamber component has a body. The body has a top surface and a bottom surface. A part wear indicator material is disposed in the chamber component body. The part wear indicator has a body. The body of the part wear indicator has a transparent first layer. A second layer has a tracer material disposed therein and wherein the first layer is closer to the top surface of the top surface than the second layer.Type: GrantFiled: August 22, 2016Date of Patent: February 16, 2021Assignee: Applied Materials, Inc.Inventors: Mats Larsson, Kevin A. Papke
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Patent number: 10883972Abstract: Embodiments of the disclosure generally relate to a system, apparatus and method for testing a coating over a semiconductor chamber component. In one embodiment, a test station comprises a hollow tube, a sensor coupled to a top end of the tube and a processing system communicatively coupled to the sensor. The hollow tube has an open bottom end configured for sealingly engaging a coating layer of the semiconductor chamber component. The sensor is configured to detect the presence of a gaseous byproduct of a reaction between a reagent disposed in the hollow tube and a base layer disposed under the coating layer. The processing system is configured to determine exposure of the base layer through the coating layer in response to information about the presence of the gaseous byproduct. In another embodiment, the processing system is communicatively coupled to each sensor of a plurality of test stations.Type: GrantFiled: February 9, 2017Date of Patent: January 5, 2021Assignee: Applied Materials, Inc.Inventors: Tasnuva Tabassum, Mats Larsson, Kevin A. Papke
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Publication number: 20200354833Abstract: A method of forming a protective coating film for halide plasma resistance includes depositing a seed layer on a surface of an article via an atomic layer deposition (ALD) process, depositing a rare-earth containing oxide layer on the seed layer via an ALD process, and exposing the rare-earth containing oxide layer to fluorine-containing plasma.Type: ApplicationFiled: May 10, 2019Publication date: November 12, 2020Inventors: Yogita PAREEK, Kevin A. PAPKE, Emily Sierra THOMSON, Mahmut Sami KAVRIK, Andrew C. KUMMEL
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Publication number: 20200270747Abstract: One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz.Type: ApplicationFiled: February 14, 2020Publication date: August 27, 2020Inventors: Mats LARSSON, Kevin A. PAPKE, Chirag Shaileshbhai KHAIRNAR, Rajasekhar PATIBANDLA, Karthikeyan BALARAMAN, Balamurugan RAMASAMY, Kartik SHAH, Umesh M. KELKAR
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Patent number: 10583465Abstract: The implementations described herein generally relate to 30 nm in-line liquid particle count testing equipment which analyses and cleans semiconductor processing equipment. More specifically, the implementations described relate to a system for diluting, analyzing, and modifying fluids to enable the observation of the contents of the fluids. A dilution sampling tool is coupled with a liquid particle detector for reading the contents of an extraction solution containing particles from semiconductor processing equipment, such as a liner, a shield, a faceplate, or a showerhead, in a cleaning tank. As such, accurate liquid particle readings may be had which reduce oversaturation of the particle detector.Type: GrantFiled: April 13, 2017Date of Patent: March 10, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jianqi Wang, William Ming-ye Lu, Yixing Lin, Kevin A. Papke
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Publication number: 20200020511Abstract: Embodiments of the present disclosure provide protective coatings, i.e., diffusion and thermal barrier coatings, for aluminum alloy substrates. In particular, embodiments described herein provide a protective layer stack comprising a tantalum nitride layer disposed on an aluminum alloy substrate and a ceramic layer disposed on the tantalum nitride layer. In some embodiments, the aluminum alloy substrates comprise processing chambers and processing chamber components used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, an article includes a substrate, a tantalum nitride layer disposed on the substrate, and a ceramic layer disposed on the tantalum nitride layer.Type: ApplicationFiled: May 14, 2019Publication date: January 16, 2020Inventors: Karthikeyan BALARAMAN, Balamurugan RAMASAMY, Kartik SHAH, Mats LARSSON, Kevin A. PAPKE, Rajasekhar PATIBANDLA, Sathyanarayana BINDIGANAVALE, Umesh M. KELKAR
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Publication number: 20200013589Abstract: Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20° C. to about 300° C. during use of the process chamber. The protective multilayer coating comprises a bond layer and a top layer, the bond layer is formed on a chamber component to reduce the stress between the top layer and the chamber component. The reduced stress decreases or prevents particle shedding from the top layer of the multilayer coating during and after use of the process chamber. The bond layer comprises titanium, titanium nitride, aluminum, or combinations thereof, and the top layer comprises tungsten nitride.Type: ApplicationFiled: May 2, 2019Publication date: January 9, 2020Inventors: Karthikeyan BALARAMAN, Sathyanarayana BINDIGANAVALE, Rajasekhar PATIBANDLA, Balamurugan RAMASAMY, Kartik SHAH, Umesh M. KELKAR, Mats LARSSON, Kevin A. PAPKE, William M. LU
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Publication number: 20190264314Abstract: Disclosed herein is a poly-crystalline protective coating on a surface of a chamber component. The poly-crystalline protective coating may be deposited by thermal spraying and may comprise cubic yttria and monoclinic yttria. At least one of: (1) the ratio of the cubic yttria to monoclinic yttria, (2) the crystallite size of at least one of the cubic yttria or the monoclinic yttria, (3) the atomic ratio of oxygen (O) to yttria (Y), and/or (4) the dielectric properties of the poly-crystalline protective coating may be controlled to obtain consistent chamber performance when switching coated chamber components within a chamber of interest.Type: ApplicationFiled: February 12, 2019Publication date: August 29, 2019Inventors: Ramesh Gopalan, Yixing Lin, Tasnuva Tabassum, Siamak Salimian, Yikai Chen, Kevin Papke
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Patent number: 10253406Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.Type: GrantFiled: March 7, 2017Date of Patent: April 9, 2019Assignee: Applied Materials, Inc.Inventors: Laksheswar Kalita, Prerna S. Goradia, Geetika Bajaj, Yogita Pareek, Yixing Lin, Dmitry Lubomirsky, Ankur Kadam, Bipin Thakur, Kevin A. Papke, Kaushik Vaidya
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Patent number: 10233554Abstract: The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.Type: GrantFiled: March 7, 2017Date of Patent: March 19, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Yogita Pareek, Laksheswar Kalita, Geetika Bajaj, Kevin A. Papke, Ankur Kadam, Bipin Thakur, Yixing Lin, Dmitry Lubomirsky, Prerna S. Goradia
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Publication number: 20190070639Abstract: Disclosed herein is an apparatus for cleaning a process kit comprising a body, a cleaning source, and a control system. The body is formed from multiple modules configured to couple to, and receive therein, a process kit part. A plurality of cleaning agents may be sequentially delivered to the body in order to remove the particles disposed on the process part.Type: ApplicationFiled: October 16, 2017Publication date: March 7, 2019Inventors: Roy C. NANGOY, Allen L. D'AMBRA, Kevin A. PAPKE
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Publication number: 20180330929Abstract: Embodiments of the disclosure generally relate to methods for removal of accumulated process byproducts from components of a semiconductor processing chamber. In one embodiment of the disclosure, a method for cleaning components within a processing chamber is disclosed. The method includes heating the components within the processing chamber to a temperature between about 150-300 degrees Celsius, exposing the components of the chamber to one or more precursor gases and removing a product of a reaction between a fluorine-based compound disposed on the components and the one or more precursor gases. The one or more precursor gases include trimethyl aluminum or tin acetylacetonate.Type: ApplicationFiled: May 10, 2017Publication date: November 15, 2018Inventors: Ranga Rao ARNEPALLI, Bipin THAKUR, Kevin A. PAPKE, Yogita PAREEK