Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Abstract: An optical module includes a transparent substrate and a refractive optical element mounted on the substrate. A conductive heating trace is deposited on the substrate around the refractive optical element. A temperature sensor senses a temperature of the substrate. Control circuitry is coupled to the temperature sensor so as to measure a difference between the temperature of the substrate and a target operating temperature of the module, and to drive a current through the conductive heating trace, responsively to the difference, so as to heat the substrate to the target operating temperature.

Abstract: A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.

Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Abstract: An optical module includes a transparent substrate and a refractive optical element mounted on the substrate. A conductive heating trace is deposited on the substrate around the refractive optical element. A temperature sensor senses a temperature of the substrate. Control circuitry is coupled to the temperature sensor so as to measure a difference between the temperature of the substrate and a target operating temperature of the module, and to drive a current through the conductive heating trace, responsively to the difference, so as to heat the substrate to the target operating temperature.

Abstract: A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.

Abstract: A remotely adjustable gastric band system is provided. The system includes a gastric band, an implantable fluid reservoir, and a fluid handling device including a piezoelectric pump, and a drive or controller assembly. The piezoelectric pump includes a diaphragm having a compressible spring positioned at an actuator side of the diaphragm, and a space occupying layer disposed between the compressible spring and the actuator side.

Abstract: A chip carrier having improver thermal properties, wherein the chip carrier may be formed having waist section, and a first transverse end portion joined to the waist section. A first surface of the carrier being configured to receive a chip thereon, and a second surface of the carrier configured to be coupled to a thermal control unit to provide cooling of the carrier and chip. The chip carrier may have a second transverse end portion joined to the waist portion in certain embodiments.

Abstract: A remotely adjustable gastric band system is provided. The system includes a gastric band, an implantable fluid reservoir, and a fluid handling device including a piezoelectric pump, and a drive or controller assembly. The piezoelectric pump includes a diaphragm having a compressible spring positioned at an actuator side of the diaphragm, and a space occupying layer disposed between the compressible spring and the actuator side.

Abstract: A chip carrier having improver thermal properties, wherein the chip carrier may be formed having waist section, and a first transverse end portion joined to the waist section. A first surface of the carrier being configured to receive a chip thereon, and a second surface of the carrier configured to be coupled to a thermal control unit to provide cooling of the carrier and chip. The chip carrier may have a second transverse end portion joined to the waist portion in certain embodiments.

Abstract: A hookswitch actuator including an activating mechanism which maintains the hookswitch circuit of a telephone in an "on hook" state when the activating mechanism is in a first position, or in an "off hook" state when the activating mechanism is in the second position. The movement of the activating mechanism between the two positions is accomplished through the use of a shape memory alloy mechanism. The shape memory alloy mechanism is coupled to the activating mechanism in such a way that heating or cooling of the shape memory alloy mechanism moves the activating mechanism between its two positions. Control of the heating and cooling of the shape memory alloy mechanism is effectuated by controlling the amount of electric current passing through it.

Abstract: A recumbent bicycle is powered by the driving of a crank spindle that rotates on an axis generally coincident with that of the front wheel. The crank spindle is disposed within a spindle housing supported from the front of the bicycle frame, and the spindle housing supports the front wheel through a steerably turnable intermediate hub. Steering of the handlebars causes the front wheel to turn to steer the bicycle, while the crank spindle remains in a fixed orientation to the frame so that the bicycle can be continuously driven with pedals connected to the crank spindle, which in turn is connected to the rear wheel through a sprocket and drive chain assembly.