Patents by Inventor Kevin A. Thompson

Kevin A. Thompson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal control of a probe card assembly
    Patent number: 11280827
    Abstract: An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to the probe card, and a heater to heat to at least part of the probe card assembly. A prober is configured to move a device under test (DUT) into contact with the electrical contacts of the probe card assembly.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: March 22, 2022
    Assignee: TERADYNE, INC.
    Inventors: Kevin A. Thompson, Isaac N Silva
  • Thermal control
    Patent number: 9766287
    Abstract: An example test system includes: a heating mechanism; a cooling mechanism; an instrument module having one or more interfaces to receive signals from a device under test (DUT), where the instrument module includes one or more electrical components to affect the signals, where the instrument module is between the heating mechanism and the cooling mechanism, and where the heating mechanism and the cooling mechanism are each configured to operate to maintain the instrument module within a target temperature range.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: September 19, 2017
    Assignee: Teradyne, Inc.
    Inventors: John Kenji Narasaki, Kevin A. Thompson
  • THERMAL CONTROL OF A PROBE CARD ASSEMBLY
    Publication number: 20170248632
    Abstract: An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to the probe card, and a heater to heat to at least part of the probe card assembly. A prober is configured to move a device under test (DUT) into contact with the electrical contacts of the probe card assembly.
    Type: Application
    Filed: February 29, 2016
    Publication date: August 31, 2017
    Inventors: Kevin A. Thompson, Isaac N. Silva
  • Thermal Control
    Publication number: 20160116528
    Abstract: An example test system includes: a heating mechanism; a cooling mechanism; an instrument module having one or more interfaces to receive signals from a device under test (DUT), where the instrument module includes one or more electrical components to affect the signals, where the instrument module is between the heating mechanism and the cooling mechanism, and where the heating mechanism and the cooling mechanism are each configured to operate to maintain the instrument module within a target temperature range.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 28, 2016
    Inventors: John Kenji Narasaki, Kevin A. Thompson