Abstract: An example connector mount may comprise a bracket to receive a connector. The example connector mount may further comprise a first and second guide spring disposed on the bracket. Each of the first and second guide springs may be to engage with the connector and each provide resistance to movement of the connector in a horizontal, and a vertical direction.

Abstract: In one example, a system for a socket connector includes a first alignment feature with a first height to engage with a module board, wherein the first alignment feature horizontally aligns the module board with a socket, and a second alignment feature with a second height to engage with the module board, wherein the second alignment feature vertically aligns the module board with the socket.

Abstract: A multi-port aggregated cable includes: a plurality of duplex optical fibers, each duplex optical fiber having a first end and a second end; a first optical interface attached to each of the duplex optical fibers at the first end thereof and defining multiple ports, one for each of the duplex optical fibers, the first optical interface aggregating the duplex optical fibers at the first end thereof; and a second optical interface attached to each of the duplex optical fibers at the second end thereof and defining multiple ports, one for each of the duplex optical fibers, the second optical interface aggregating the duplex optical fibers at the second end thereof.

Abstract: One example of a cable assembly includes a plurality of 1-lane cable assemblies and latching features to couple the cable assembly to a receptacle. Each 1-lane cable assembly generally includes a cable and a cable connector attached to at least one end of the cable. As an example, surfaces of each cable connector of a 1-lane cable assembly generally includes features to conjoin with corresponding features on surfaces of cable connectors of other 1-lane cable assemblies. As an example, the conjoined features may secure the 1-lane cable assemblies to each other.

Abstract: A high-density universally-configurable system board architecture for use with multiple mid-board optic (MBO) type configurations is provided. The system board comprises a switch application specific integrated circuit (ASIC) assembly, a plurality of MBO interfaces comprising a plurality of via-in-pad plated over (VIPPO) vias, and a plurality of mounting holes. Each MBO interface is configured to mate with a soldered-down MBO assembly or a socket instance comprising a socketized MBO assembly. Each socketized MBO assembly comprises an interposer comprising a plurality of VIPPO vias, where the bottom contact pad of each VIPPO via is thicker than the top contact pad. Either configuration is facilitated without the need to modify the system board layout.

Abstract: An electro-optical aggregator system includes: a system board; a plurality of cards electrically connected to the system board, the plurality of cards each comporting with a standard form factor; and an electro-optical aggregator card comporting with the standard form factor and trafficking electrical signals with the plurality of cards, the electro-optical aggregator card including an optical transceiver chip through which the trafficked signals are optically communicated.

Abstract: Systems and methods are provided for duplex-modulo connector comprising a carrier plate receiving a duplex ferrule. The carrier plate can include an entry slot that receives the duplex ferrule. The entry slot further includes neck spring leaves, and base spring leaves that support stabilizing the duplex ferrule and absorbing movement to support spring floating of the duplex ferrule. The duplex ferrule can include a receptacle connector housing, or a plug connector housing for aligning the duplex ferrule for blindmating with a complimentary duplex ferrule, wherein the carrier plate is coupled to the housing.

Abstract: An electro-optical aggregator system, includes: a system board; a plurality of cards electrically connected to the system board, the plurality of cards each comporting with a standard form factor; and an electro-optical aggregator card comporting with the standard form factor and trafficking electrical signals with the plurality of cards, the electro-optical aggregator card including an optical transceiver chip through which the trafficked signals are optically communicated.

Abstract: An edge-attachable (EA) optical connector includes an optical connector housing for an optical connector. The optical connector housing includes a slot that aligns with a module board edge finger electrical connector, such that the optical connector housing can be slid over a module board edge finger electrical connector and attached to the module board edge. An optical connector on one end of an optical fiber bundle or ribbon fits within the optical connector housing. When the optical connector housing is attached to the module board edge, the optical connector blind mates with a host optical connector supported by a bracket to which a host electrical connector is attached. An optical connector on another end of the optical fiber bundle or ribbon mates with a module board optical connector. The module board optical connector may include an optical socket mounted on an opto-electronic chip disposed on the module board.

Abstract: A housing-attachable (HA) optical connector is removably attached to a housing that is initially designed for an electrical interface with a base electrical connector on a system board. An optical fiber terminates at one end to a chip optical connector and terminates at another end to the HA optical connector. The HA optical connector is positioned with respect to the housing such that when a portion of the printed circuit board of a removable module extending outside the housing comes into contact with a base electrical connector on a system board, the HA optical connector blind mates with a base-attachable (BA) optical connector on the system board. In this manner, electrical connectivity and optical connectivity are provided between the removable module and the system board.

Abstract: A base layer architecture (BLA) infrastructure device comprises a power base layer (PBL) to supply power to a cartridge, a cold thermal base layer (cold TBL) to cool the cartridge, a hot thermal base layer (hot TBL) to remove heat from the cartridge, an optical base layer (OBL) to transmit an optical signal to the cartridge and a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge. Each base layer comprises a rack interface to couple the base layer to a rack and a number of cartridge interfaces to couple the base layers to the cartridge. A BLA infrastructure system comprises a BLA infrastructure device comprising a number of base layers. The number of base layers are removably coupled to a rack and a system management device to manage the number of base layers.

Abstract: An optical ferrule includes a substrate formed of a diced wafer and a molded structure formed on the substrate. The molded structure may be formed of a curable material. The molded structure may include a plurality of grooves for positioning a plurality of optical fibers therealong, respectively, a plurality of reflective surfaces formed to reflect optical signals from ends of the plurality of optical fibers, respectively, or reflect incident optical signals towards the ends of the plurality of optical fibers, respectively, and an alignment structure disposed to be aligned to a corresponding alignment structure of a socket to which the optical ferrule is coupled.

Abstract: Systems and methods are provided for universal-blindmate sleeve comprising mounting mechanisms for mounting the universal sleeve to a midplane. The universal-blindmate sleeve comprising a sleeve housing, having a first opening for receiving a first blindmate connector. The first opening is arranged at an end of the sleeve housing and facing a first side of the midplane. The sleeve housing further having a second opening for receiving a second blindmate connector, wherein the second opening is arranged at an opposing end of the sleeve housing and facing an opposing side of the midplane. A body of the sleeve housing is configured for blindmating the first blindmate connector to the second blindmate connector through the midplane.

Abstract: Examples herein disclose a plenum. The plenum includes an enclosed structure to deliver cool air to multiple enclosures within a rack and multiple cables to route to the multiple enclosures within the rack. The plenum further includes a connector to attach the multiple cables in the plenum to one of the multiple enclosures.

Abstract: In example implementations, an optical connector is provided. The optical connector includes a jumper holder, a base bracket, and an optical ferrule. The jumper holder holds a plurality of ribbon fibers. The base bracket is coupled to an electrical substrate to mate with the jumper holder. The optical ferrule is coupled to an end of each one of the plurality of ribbon fibers. The optical ferrule is laterally inserted into a corresponding orthogonal socket that is coupled to a silicon interposer on the electrical substrate to optically mate the optical ferrule to the orthogonal socket.

Abstract: An example electro-optical connector may comprise an optical ferrule to optically engage with a complementary optical ferrule on a complementary electro-optical connector, a first conductive guide post disposed adjacent to the optical ferrule to electrically engage with a first guide pocket of the complementary electro-optical connector, and a second conductive guide post disposed on an opposite side of the optical ferrule from the first conductive guide post and to electrically engage with a second guide pocket of the complementary electro-optical connector. The first and second conductive guide posts may align the optical ferrule for engagement with the complementary optical ferrule when the guide posts are engaged with the respective guide pockets, and the first and second conductive guide posts may conduct an electrical signal or electrical power from the electro-optical connector to the complementary electro-optical connector.

Abstract: In one example, a system for a cage assembly for an optical module includes a receptacle coupled to an interposer card, a number of rails coupled to the interposer card to align an optical module with the receptacle, and a mezzanine card coupled to the interposer card, wherein the optical module is utilized via the mezzanine card.

Abstract: Examples relate to devices comprising a stationary pivot plenum and a rocker-arm assembly pivotally coupled to the stationary pivot plenum and wherein the rocker-arm assembly comprises an inner conduit having at least one connector bay in which a connector of a cable assembly is removably coupled to the connector bay. In such examples the inner conduit of the rocker-arm assembly is accessible from the outside of the rocker-arm assembly to independently engage/disengage the removable cable assembly to/from the at least one connector bay.

Abstract: An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.

Abstract: Systems and methods are provided for a nested co-blindmate high-density optical switch system. The nested co-blindmate high-density optical switch system can include a system enclosure, and an enclosure midplane that is installed the system enclosure. Further, a switch chassis can be enclosed by the system enclosure, and liquid blindmate to a liquid line on a rack; optically blindmate to at least one blade in the system enclosure; and electrically blindmate to the enclosure midplane. At least one optical switch line-card can be included in the system, which is enclosed by the switch chassis, and further enclosed by the system enclosure in a nested manner. The at least one optical switch line-cards can liquid blindmate to the switch chassis, optically blindmate to the switch chassis, and electrically blindmate to the enclosure midplane.