Abstract: A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.

Abstract: A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.

Abstract: A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.

Abstract: Systems and methods of manipulating and transforming data and sharing ideas comprise one or more diocards and a map comprised of the one or more diocards. Each diocard represents an individual idea and has the same group of functions including a distinctions function, a systems function, a relationships function, and a perspectives function. The distinctions function enables definition of the individual idea by attributes the individual idea is comprised of and by non-attributes the individual idea is not comprised of, thereby creating libraries of interconnected ideas that range from near-exact synonyms to near-far synonyms to antonyms to totally unrelated concepts. The systems function enables definition of the individual idea as part of a whole or a whole that can be broken into parts. The relationships function enables definition of the individual idea as having a relationship with one or more different ideas and that this relationship may include action and reaction-like properties.

Abstract: A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed. A gripping member pulls the substrate into at least partial compliance with a locating structure to facilitate the proper function of a code reader. Where the indicia are not read, the substrate is moved relative to the code reader, starting from a position that may be determined based on the material properties of the substrate.

Abstract: A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed. A gripping member pulls the substrate into at least partial compliance with a locating structure to facilitate the proper function of a code reader. Where the indicia are not read, the substrate is moved relative to the code reader, starting from a position that may be determined based on the material properties of the substrate.

Abstract: A moveable semiconductor substrate support includes a control device receiving data from one or more sensors and providing control signals to one or more actuators. The control device is coupled to and moves with the moveable substrate support to facilitate flexible and complex operation of the substrate support itself.

Abstract: A moveable semiconductor substrate support includes a control device receiving data from one or more sensors and providing control signals to one or more actuators. The control device is coupled to and moves with the moveable substrate support to facilitate flexible and complex operation of the substrate support itself.

Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.

Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.

Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.

Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.

Abstract: A motion-base ride simulator includes a passenger cabin which is carried by a plurality of actuators within a limited operating envelope. During operation of the ride the movements of the passenger cabin simulate G-forces associated with an audio-visual presentation to the passengers within the cabin. The combination of sight, sound, and feeling (i.e., G-forces) provides the passengers of the ride with a sense of riding on a vehicle, such as a racing car or rocket ship. In order to facilitate one or both of passenger ingress and egress of the cabin, the motion base is so associated with a stationary passenger platform that the passenger cabin may be moved to a passenger access position immediately adjacent to but not touching an adjacent edge of this platform. In this passenger access position of the cabin passengers may enter into or leave from the passenger cabin without use of a movable passenger platform.