Abstract: Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.

Abstract: Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.

Abstract: Methods of plating electrical contacts on a photosensitive device are provided. Also provided are methods of plating electrical contacts on solar cells.

Abstract: An apparatus, method and system electrostatically guide ionized droplets of a material in chemical or biological array fabrication. The apparatus comprises a plurality of deposition sites and an area surrounding the plurality of sites on a surface of a substrate. An electrostatic charge differential is generated on the apparatus between a selected set of deposition sites and the surrounding area remaining around the selected set. In some embodiments, the substrate comprises a photoconductive layer overlying a conductive layer. In other embodiments, the substrate comprises circuit paths interconnecting to electrode pads defined in the substrate. The electrode pads correspond to the plurality of deposition sites. The substrate may further comprise a membrane sheet that supports the deposition sites. The method further comprises exposing the array to the ionized droplets after the electrostatic charge differential is generated. The apparatus provides an electrostatically changeable deposition mask.

Abstract: A holder for fluorometric analysis of PCR reaction tubes comprises a longitudinal block, the block being sized to fit within a fluorometer; a cavity disposed along a longitudinal axis of the block; at least one test well within the cavity, the test well having an internal wall sized to closely receive and maintain intimate contact with a substantial portion of a single PCR reaction tube therein; the internal wall having at least one optical port therein; and a cover movably connected to the block.

Abstract: A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

Abstract: A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

Abstract: This method enables two components (1, 3) to be joined by soldering using heat generated by a laser beam, without the use of flux. A layer (5) of a material which has a lower melting point than the material of one of the components (3) is formed on that component and forms a bond therewith on resolidifying after melting. Solder (7) is interposed between the layer (5) and the other component (1) to form, on resolidification after melting, bonds with the material of the layer (5) and the other component (1). A coating (11) of a further material between the layer (5) and the solder (7) is dispersed when the adjacent layer material becomes molten and is not wetted by the solder (7) when molten. On applying heat to a region (15) of the layer using a laser beam, the layer is melted in this region (15) as is the adjacent solder (7) to form, on resolidification of the solder (7) and molten layer material (15 ), bonds between the solder (7) and the two components (1, 3).