Patents by Inventor Kevin C. Douglas

Kevin C. Douglas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Demountable tape-automated bonding method
    Patent number: 5276961
    Abstract: A Demountable Tape-Automated Bonding System for providing connections to a chip is disclosed. The chip is attached to or is held in place on a TAB frame that includes a generally flexible dielectric film which bears a pattern of conductive traces. A multitude of closely-spaced contacts which protrude downward from the chip contact the conductive traces on the TAB frame. The chip may be maintained in its proper location on the TAB frame by either a bonding agent or by compressive forces supplied by a cap which is fastened to the TAB frame and to a substrate, such as a printed circuit board, below the TAB frame. The substrate carries an array of conductive traces around the edges of the substrate. These traces match the traces on the TAB frame. The conductor traces on the TAB frame and on the substrate are held in contact with each other by compressive forces supplied by the cap which is fastened to the TAB frame and to the substrate.
    Type: Grant
    Filed: April 28, 1992
    Date of Patent: January 11, 1994
    Assignee: Hewlett-Packard Company
    Inventors: Farid Matta, Kevin C. Douglas
  • Demountable tape-automated bonding system
    Patent number: 5142444
    Abstract: A Demountable Tape-Automated Bonding System for providing connections to a chip is disclosed. The chip is attached to or is held in place on a TAB frame that includes a generally flexible dielectric film which bears a pattern of conductive traces. A multitude of closely-spaced contacts which protrude downward from the chip contact the conductive traces on the TAB frame. The chip may be maintained in its proper location on the TAB frame by either a bonding agent or by compressive forces supplied by a cap which is fastened to the TAB frame and to a substrate, such as a printed circuit board, below the TAB frame. The substrate carries an array of conductive traces around the edges of the substrate. These traces match the traces on the TAB frame. The conductor traces on the TAB frame and on the substrate are held in contact with each other by compressive forces supplied by the cap which is fastened to the TAB frame and to the substrate.
    Type: Grant
    Filed: July 26, 1991
    Date of Patent: August 25, 1992
    Assignee: Hewlett-Packard Company
    Inventors: Farid Matta, Kevin C. Douglas
  • Demountable tape-automated bonding system
    Patent number: 5053922
    Abstract: A Demountable Tape-Automated Bonding System for providing connections to a chip is disclosed. The chip is attached to or is held in place on a TAB frame that includes a generally flexible dielectric film which bears a pattern of conductive traces. A multitude of closely-spaced contacts which protrude downward from the chip contact the conductive traces on the TAB frame. The chip may be maintained in its proper location on the TAB frame by either a bonding agent or by compressive forces supplied by a cap which is fastened to the TAB frame and to a substrate, such as a printed circuit board, below the TAB frame. The substrate carries an array of conductive traces around the edges of the substrate. These traces match the traces on the TAB frame. The conductor traces on the TAB frame and on the substrate are held in contact with each other by compressive forces supplied by the cap which is fastened to the TAB frame and to the substrate.
    Type: Grant
    Filed: August 31, 1989
    Date of Patent: October 1, 1991
    Assignee: Hewlett-Packard Company
    Inventors: Farid Matta, Kevin C. Douglas