Abstract: The present invention is related to a sensor. In particular, the present invention is related to a pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a pressure sensor die is provided. The pressure sensor die is uniformly compressed by the external pressure to be measured and can deform freely inside the chamber. The pressure sensor die is primarily constructed of single crystalline silicon and comprises a substrate and a cap connected together. A recess is formed on the cap. The recess forms a sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. The substrate further comprises a plurality of piezoresistive sensing elements which are located inside the sealed cavity. The present pressure sensor is more immune to temperature effects. It is especially suitable for operating in a high temperature, high pressure environment and is capable of delivering accurate and reliable pressure measurements at low cost.

Abstract: A pressure sensor die especially suitable for high-temperature, high-pressure operating environment and delivering accurate and reliable pressure measurement at low cost. A single crystalline silicon includes a cap, a substrate and a base connected together. A recess formed on the cap creates an upper sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. A recess formed on the base creates a lower sealed cavity with the substrate. The upper sealed cavity and the lower sealed cavity overlap in their projections. The substrate includes at least two sets of piezoresistive sensing elements located within the overlapping projections, perpendicular to each other, and oriented in different crystallographic directions.

Abstract: A pressure sensor die especially suitable for high-temperature, high-pressure operating environment and delivering accurate and reliable pressure measurement at low cost. A single crystalline silicon includes a cap, a substrate and a base connected together. A recess formed on the cap creates an upper sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. A recess formed on the base creates a lower sealed cavity with the substrate. The upper sealed cavity and the lower sealed cavity overlap in their projections. The substrate includes at least two sets of piezoresistive sensing elements located within the overlapping projections, perpendicular to each other, and oriented in different crystallographic directions.

Abstract: A pressure sensor die especially suitable for high-temperature, high-pressure operating environment and delivering accurate and reliable pressure measurement at low cost. A single crystalline silicon includes a cap, a substrate and a base connected together. A recess formed on the cap creates an upper sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. A recess formed on the base creates a lower sealed cavity with the substrate. The upper sealed cavity and the lower sealed cavity overlap in their projections. The substrate includes at least two sets of piezoresistive sensing elements located within the overlapping projections, perpendicular to each other, and oriented in different crystallographic directions.

Abstract: The present invention is related to a sensor. In particular, the present invention is related to a MEMS strain gauge die and its fabrication process. The MEMS strain gauge die comprises a handle, a device layer and a cap all connected together. A silicon oxide layer is formed between the handle and the device layer. Another silicon oxide layer is formed between the device layer and the cap. Recesses are respectively formed on the handle and the cap and face each other. The handle recess and the cap recess are connected to form a cavity. The device layer, which spans the cavity, further comprises a bridge on which a plurality of piezoresistive sensing elements are formed. The present strain gauge die is more immune to temperature effects. It is especially suitable for operating in a high temperature environment and is capable of delivering accurate and reliable strain measurements at low cost.

Abstract: The present invention relates to a MEMS pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a MEMS pressure sensor die is provided. The pressure sensor die comprises a handle, a device layer and a cap all connected together. A silicon oxide layer is formed between the handle and the device layer. Another silicon oxide layer is formed between the device layer and the cap. Recesses are respectively formed on the handle and the cap and face each other. The handle recess and the cap recess are connected to form a cavity. The device layer, which spans the cavity, further comprises a bridge on which a plurality of piezoresistive sensing elements are formed. The present pressure sensor is more immune to temperature effects. It is especially suitable for operating in a high temperature, high pressure environment and is capable of delivering accurate and reliable pressure measurements at low cost.

Abstract: A cell-aware defect characterization method includes partitioning a multibit cell netlist file into multiple single-bit partition netlist files, and then generating a cell-aware test model for each partition netlist file. Partitioning is performed such that each partition netlist file includes a corresponding flip-flop along with input, output and control pins that are operably coupled to the input, output and control terminals of the corresponding flip-flop, and all active, passive and parasitic circuit elements that are coupled in the signal paths extending between the corresponding flip-flop and the input/output/control pins. Shared resources (e.g., clock or scan select pins and associated signal lines) that are utilized by two or more flip-flops are included in each associated partition. The partitioning process is performed using either a structural back-tracing approach or a logic simulation approach.

Abstract: A computer-implemented method for characterizing a circuit is presented. The method includes receiving, by the computer, data representative of the circuit and at least one defect of the circuit. The method further includes simulating, using the computer, the circuit to obtain a first timing characteristic, and simulating, using the computer, the circuit with the at least one defect to obtain a second timing characteristic. The method further includes identifying, using the computer, an association between at least one test vector and the at least one defect in accordance with the first timing characteristic, the second timing characteristic, and a multitude of strobes applied during a first time interval associated with the at least one test vector, when the computer is invoked to characterize the circuit.

Abstract: The present invention is related to a sensor. In particular, the present invention is related to a dual-cavity pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a pressure sensor die is provided. The pressure sensor die is uniformly compressed by the external pressure to be measured and can deform freely inside the chamber. The pressure sensor die is primarily constructed of single crystalline silicon and comprises a cap, a substrate and a base connected together. A recess is formed on the cap. The recess forms an upper sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. The substrate further comprises a plurality of piezoresistive sensing elements which are located inside the upper sealed cavity. A recess is formed on the base. The recess forms a lower sealed cavity with the substrate. The present pressure sensor is more immune to temperature effects.

Abstract: The present invention is related to a sensor. In particular, the present invention is related to a pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a pressure sensor die is provided. The pressure sensor die is uniformly compressed by the external pressure to be measured and can deform freely inside the chamber. The pressure sensor die is primarily constructed of single crystalline silicon and comprises a substrate and a cap connected together. A recess is formed on the cap. The recess forms a sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. The substrate further comprises a plurality of piezoresistive sensing elements which are located inside the sealed cavity. The present pressure sensor is more immune to temperature effects. It is especially suitable for operating in a high temperature, high pressure environment and is capable of delivering accurate and reliable pressure measurements at low cost.

Abstract: The present invention is related to a sensor. In particular, the present invention is related to a MEMS strain gauge die and its fabrication process. The MEMS strain gauge die comprises a handle, a device layer and a cap all connected together. A silicon oxide layer is formed between the handle and the device layer. Another silicon oxide layer is formed between the device layer and the cap. Recesses are respectively formed on the handle and the cap and face each other. The handle recess and the cap recess are connected to form a cavity. The device layer, which spans the cavity, further comprises a bridge on which a plurality of piezoresistive sensing elements are formed. The present strain gauge die is more immune to temperature effects. It is especially suitable for operating in a high temperature environment and is capable of delivering accurate and reliable strain measurements at low cost.

Abstract: The present invention relates to a MEMS pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a MEMS pressure sensor die is provided. The pressure sensor die comprises a handle, a device layer and a cap all connected together. A silicon oxide layer is formed between the handle and the device layer. Another silicon oxide layer is formed between the device layer and the cap. Recesses are respectively formed on the handle and the cap and face each other. The handle recess and the cap recess are connected to form a cavity. The device layer, which spans the cavity, further comprises a bridge on which a plurality of piezoresistive sensing elements are formed. The present pressure sensor is more immune to temperature effects. It is especially suitable for operating in a high temperature, high pressure environment and is capable of delivering accurate and reliable pressure measurements at low cost.

Abstract: A computer-implemented method for characterizing a circuit is presented. The method includes receiving, by the computer, data representative of the circuit and at least one defect of the circuit. The method further includes simulating, using the computer, the circuit to obtain a first timing characteristic, and simulating, using the computer, the circuit with the at least one defect to obtain a second timing characteristic. The method further includes identifying, using the computer, an association between at least one test vector and the at least one defect in accordance with the first timing characteristic, the second timing characteristic, and a multitude of strobes applied during a first time interval associated with the at least one test vector, when the computer is invoked to characterize the circuit.

Abstract: The invention generally features methods for providing hepatocytes from a variety of cell sources, particularly pluripotent stem cells, therapeutic compositions featuring such cells, and methods of using them for the treatment of subjects.

Abstract: The invention generally features methods for providing hepatocytes from a variety of cell sources, particularly pluripotent stem cells, therapeutic compositions featuring such cells, and methods of using them for the treatment of subjects.

Abstract: The invention generally features methods for providing hepatocytes from a variety of cell sources, particularly pluripotent stem cells, therapeutic compositions featuring such cells, and methods of using them for the treatment of subjects.

Abstract: The invention generally features methods for providing hepatocytes from a variety of cell sources, particularly pluripotent stem cells, therapeutic compositions featuring such cells, and methods of using them for the treatment of subjects.

Abstract: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

Abstract: An improved golf club head is disclosed which comprises the positioning of secondary weights at such low, rearward and outward locations that it causes an alteration in the traditional look of the club head wherein each secondary weight has a portion of the weight that bulges outwards of the natural contour of the club head.

Abstract: A golf club head is disclosed. The golf club head includes a first body member and a second body member. The first body member includes a strike face and a top portion. The second body member is coupled to the first body member and extends away from the first body member in a direction opposite the strike face. At least a top portion of the second body member is camouflaged. A preferred method of camouflage is color differentiation, wherein the second body member is darker than the first body member. Specific color values and club head geometries are also disclosed and claimed. The club head may include a body member and a weight member such as a bar that extends rearward from the body member. A cover may be included to camouflage the weight member. A separate core member and high visibility sight lines may also be provided.