Patents by Inventor Kevin Conn
Kevin Conn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11678465Abstract: In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.Type: GrantFiled: November 8, 2018Date of Patent: June 13, 2023Assignee: Hewlett Packard Enterprise Development LPInventors: Kevin Conn, Pinche Tsai, Keith Sauer
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Patent number: 11248723Abstract: A cable management arm basket clip, comprising: a latch to secure the cable management arm basket clip to a cable management arm basket; a connection to pivotally connect the cable management arm basket clip to the cable management arm basket; and guards disposed on both sides of the cable management arm basket clip to allow for passage of cables and to protect cables.Type: GrantFiled: October 16, 2019Date of Patent: February 15, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: Daniel W. Tower, Kevin Bold, Kevin Conn
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Publication number: 20210352821Abstract: In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.Type: ApplicationFiled: November 8, 2018Publication date: November 11, 2021Inventors: Kevin Conn, Pinche Tsai, Kevin Sauer
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Publication number: 20210116052Abstract: A cable management arm basket clip, comprising: a latch to secure the cable management arm basket clip to a cable management arm basket; a connection to pivotally connect the cable management arm basket clip to the cable management arm basket; and guards disposed on both sides of the cable management arm basket clip to allow for passage of cables and to protect cables.Type: ApplicationFiled: October 16, 2019Publication date: April 22, 2021Inventors: Daniel W. TOWER, Kevin BOLD, Kevin CONN
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Patent number: 10514735Abstract: According to some examples, solutions are provided for setting a cooling system of a computer system chassis by a positionable cover disposed on a computer hardware component receivable by the computer system chassis.Type: GrantFiled: September 30, 2015Date of Patent: December 24, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Mohammed Fai Qureshi, Kevin Conn, Victoria Jeanine Doehring
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Publication number: 20190334266Abstract: A double stack connector electrically connects a PCB to a first and a second M.2 module. The connector includes a plurality of pins that form a first row of pins and a second row of pins for connection to PCB at one end, and to the first and second M.2 modules at a second end. The PCB is able to concurrently operate the first and second M.2 modules via the first and the second row of pins of the connector.Type: ApplicationFiled: April 30, 2018Publication date: October 31, 2019Inventors: Victoria Doehring-Patel, Kevin Conn
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Publication number: 20190267586Abstract: Examples described herein relate to coin cell battery housing. In one example, a device for housing a coin cell battery includes a receptacle to receive the coin cell battery, a connector to couple the device to an electronic board, and a hinge to couple the receptacle to the connector. The hinge is to allow rotation of the receptacle in a horizontal position and a vertical position, where in the horizontal position, a gap is maintained between the receptacle and the board such that a component can be mounted on the board under the receptacle.Type: ApplicationFiled: July 29, 2016Publication date: August 29, 2019Inventors: Kevin Conn, Chanh V Hua
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Publication number: 20180246549Abstract: According to some examples, solutions are provided for setting a cooling system of a computer system chassis by a positionable cover disposed on a computer hardware component receivable by the computer system chassis.Type: ApplicationFiled: September 30, 2015Publication date: August 30, 2018Inventors: Mohammed Fai Qureshi, Kevin Conn, Victoria Jeanine Doehring
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Patent number: 6985358Abstract: The present invention is a fan tray assembly in a computer chassis which allows fan assemblies to be removed and installed without shutting down the computer device. The fan tray assembly includes two or more fan assemblies for cooling the interior of the chassis. The fan tray assembly has a first position in which the fan tray assembly is received in the chassis and an extended position in which the fan tray assembly extends from an opening in the chassis. The fan tray assembly has an endplate, a left side, a right side, and at least one of the sides includes one or more slots for receiving a fan assembly. A hot tap board mounted to the fan tray assembly is connected to a power cable. The fan assemblies are hot tap connected to the hot tap board. The present invention allows the fan assembly to be removed without shutting down the device by extending the fan tray assembly from the computer chassis and removing the fan assembly from the fan tray assembly.Type: GrantFiled: November 19, 2003Date of Patent: January 10, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Daniel T. Thompson, Kevin Conn, Erik Robert Nielsen, Robert J. Hastings
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Publication number: 20040075983Abstract: The present invention is a fan tray assembly in a computer chassis which allows fan assemblies to be removed and installed without shutting down the computer device. The fan tray assembly includes two or more fan assemblies for cooling the interior of the chassis. The fan tray assembly has a first position in which the fan tray assembly is received in the chassis and an extended position in which the fan tray assembly extends from an opening in the chassis. The fan tray assembly has an endplate, a left side, a right side, and at least one of the sides includes one or more slots for receiving a fan assembly. A hot tap board mounted to the fan tray assembly is connected to a power cable. The fan assemblies are hot tap connected to the hot tap board. The present invention allows the fan assembly to be removed without shutting down the device by extending the fan tray assembly from the computer chassis and removing the fan assembly from the fan tray assembly.Type: ApplicationFiled: November 19, 2003Publication date: April 22, 2004Inventors: Daniel T. Thompson, Kevin Conn, Erik Robert Nielsen, Robert J. Hastings
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Patent number: 6714411Abstract: The present invention is a fan tray assembly in a computer chassis which allows fan assemblies to be removed and installed without shutting down the computer device. The fan tray assembly includes two or more fan assemblies for cooling the interior of the chassis. The fan tray assembly has a first position in which the fan tray assembly is received in the chassis and an extended position in which the fan tray assembly extends from an opening in the chassis. The fan tray assembly has an end plate, a left side, and a right side, and at least one of the sides includes one or more slots for receiving a fan assembly. A hot tap board mounted to the fan tray assembly is connected to a power cable. The fan assemblies are hot tap connected to the hot tap board. The present invention allows the fan assembly to be removed without shutting down the device by extending the fan tray assembly from the computer chassis and removing the fan assembly from the fan tray assembly.Type: GrantFiled: December 31, 2001Date of Patent: March 30, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Daniel T. Thompson, Kevin Conn, Erik Robert Nielsen, Robert J. Hastings
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Publication number: 20030123222Abstract: The present invention is a fan tray assembly in a computer chassis which allows fan assemblies to be removed and installed without shutting down the computer device. The fan tray assembly includes two or more fan assemblies for cooling the interior of the chassis. The fan tray assembly has a first position in which the fan tray assembly is received in the chassis and an extended position in which the fan tray assembly extends from an opening in the chassis. The fan tray assembly has an end plate, a left side, and a right side, and at least one of the sides includes one or more slots for receiving a fan assembly. A hot tap board mounted to the fan tray assembly is connected to a power cable. The fan assemblies are hot tap connected to the hot tap board. The present invention allows the fan assembly to be removed without shutting down the device by extending the fan tray assembly from the computer chassis and removing the fan assembly from the fan tray assembly.Type: ApplicationFiled: December 31, 2001Publication date: July 3, 2003Inventors: Daniel T. Thompson, Kevin Conn, Erik Robert Nielsen, Robert J. Hastings
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Patent number: D732041Type: GrantFiled: November 18, 2014Date of Patent: June 16, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kevin Conn, Keith J. Kuehn, Robert J. Kelley
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Patent number: D779858Type: GrantFiled: November 18, 2014Date of Patent: February 28, 2017Assignee: Hewlett Packard Enterprise Development LPInventors: Kevin Conn, Keith J. Kuehn, Robert J. Kelley