Patents by Inventor Kevin COTNER

Kevin COTNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH THERMAL CONDUCTIVE HERMETIC RF PACKAGING
    Publication number: 20170236769
    Abstract: A thermal packaging device for dissipating heat generated by electronic components comprising a copper base and a ceramic frame mounted to the base with a buffer comprising a nickel-cobalt ferrous alloy. Also disclosed is a thermal packaging device with a base comprised of a layer of copper molybdenum alloy sandwiched between two layers of copper and a ceramic frame mounted to the base. Further disclosed is a thermal packaging device with a base comprised of alternating layers of copper, molybdenum, and copper; and a ceramic frame mounted to the base.
    Type: Application
    Filed: February 13, 2017
    Publication date: August 17, 2017
    Inventors: Sanchayan DUTTA, Kevin COTNER