Abstract: The present disclosure is directed to a process for electroless deposition of metal atoms on an electrode. The process includes treating a carbon-containing support by contacting the carbon-containing support with a treatment, impregnating the carbon-containing support with a precursor metal component to form seed sites on the carbon-containing support, and depositing metal atoms on the seed sites through electroless deposition by contacting the carbon-containing support with a metal salt and a reducing agent.

Abstract: In one embodiment, the present disclosure is directed to a process for electroless deposition of metal atoms on an electrode to form a core and shell structure. The process includes treating a carbon-containing support by contacting the carbon-containing support with a treatment. The carbon-containing support is impregnated with a core component metal to form at least one seed site on the carbon-containing support. A predetermined amount of shell component metal is deposited on the at least one seed site of the core component through electroless deposition by contacting the carbon-containing support with a metal salt and a reducing agent. The shell component forms at least one complete monolayer on the core component. The amount of the shell component deposited is predetermined by using the surface area of the core component.