Abstract: An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed upon one of the printed circuit board and/or substrate, and a liquid adhesive is printed onto the printing tool. The liquid adhesive forms islands of adhesive within each aperture. Removing the printing tool deforms each island to form a raised edge at a periphery of each island. A temporary liner can be placed on the raised edges to protect the adhesive until the printed circuit board can be assembled with the substrate.

Abstract: An electronic control unit having a flexible circuit board assembly is disclosed. The electronic control unit comprises a flexible circuit board with at least one layer having first and second portions separated by a bendable region. The electronic control unit further comprises a substantially rigid substrate having first and second portions separated by a bend region and inside and outside surfaces. The first and second portions of the circuit board are affixed to respective first and second portions of the substrate. The bend region has one of the group of a recess and aperture extending outwardly from the inside surface of the substrate with the one of the group of the recess and aperture sized to accept the bendable region of the circuit board.

Abstract: A flexible circuit board assembly and method includes a rigid circuit board having a first portion and a second portion separated by a bending region. A plurality of grooves are cut into the bending region. The grooves are cut substantially parallel to an axis about which the bending region is bent. Preferably, the grooves are located on an inside bending radius of the circuit board, but can be located on the outside radius or both.

Abstract: A flexible circuit board (20) having a substantially rigid substrate (22) and an electrical resistance heater trace (24). The substantially rigid substrate (22) has a first portion (26), a second portion (28), and a bend region (30). The bend region (30) interconnects the first portion (26) and the second portion (28). The electrical resistance heater trace (24) is formed on the bend region (30) of the substrate (22). The first portion (26) of the substrate (22) is capable of being folded relative to the second portion (28) of the substrate (22) to form at least one bend (72, 172) in the bend region (30) when an electric current is applied to the heater trace (24). There is also an electronic control unit (60, 160) that includes the flexible circuit board (20) and a method of assembling an electronic control unit (60, 160).

Abstract: A flexible circuit board (20) having a substantially rigid substrate (22) and an electrical resistance heater trace (24). The substantially rigid substrate (22) has a first portion (26), a second portion (28), and a bend region (30). The bend region (30) interconnects the first portion (26) and the second portion (28). The electrical resistance heater trace (24) is formed on the bend region (30) of the substrate (22). The first portion (26) of the substrate (22) is capable of being folded relative to the second portion (28) of the substrate (22) to form at least one bend (72, 172) in the bend region (30) when an electric current is applied to the heater trace (24). There is also an electronic control unit (60, 160) that includes the flexible circuit board (20) and a method of assembling an electronic control unit (60, 160).

Abstract: A multiple cure adhesive (204) is used to secure a circuit substrate (104) to an underlying rigid surface (106). The adhesive is screen printed on the underlying surface. A first cure is then applied to the adhesive to at least partially cure the adhesive and to make the adhesive tacky. The circuit substrate is mounted on the tacky adhesive and a second cure is applied to the adhesive to firmly secure the circuit substrate to the housing. By screen printing the adhesive on the underlying surface, the process of mounting a circuit substrate on a rigid surface can be completely automated, providing cost saving and waste reduction.

Abstract: An electronic control unit (ECU) includes a flexible circuit substrate having a first partition interconnected to a third partition by a second, flexible partition. The electronic control unit further includes a rigidizer having a first partition interconnected to a third partition by a second partition. When the ECU is twice folded, the second, flexible partition of the circuit substrate assumes an approximate ‘U’-shape, resulting in a reduced cracking and splitting rate than the prior art. In various embodiments of the present invention, the assumption of a ‘U’-shaped fold in the second, flexible partition of the circuit substrate is facilitated by multiple apertures in a second rigidizer partition, by a depression in a second rigidizer partition, or by non-slidably affixing a first circuit substrate partition to a first rigidizer partition via a first adhesive and non-slidably affixing a third circuit substrate partition to a third rigidizer partition via a second adhesive.

Abstract: A flexible circuit (100) includes a first circuit path portion (110) and a second rigid circuit path portion (140) to which electronic components (102) may be coupled. Each circuit path portion (110 and 140) including a resin layer (112 and 142) and an adjacent conductive layer (114 and 144). Each circuit path portion (110 and 140) defining a gap (120 and 150) substantially running along a line corresponding to a desired bend location. A central circuit path portion (130) is disposed between the first circuit path portion (110) and the second rigid circuit path portion (140) and includes a first conductive layer (134) in electrical communication with the first circuit path portion (110) and a second conductive layer (136) in electrical communication with the second rigid circuit path portion (140), so as to provide electrical communication across the gaps (120 and 150). A metal plate (160) is disposed adjacent the second rigid circuit path portion (140).

Abstract: A drawing tool and method having a snap function for constraining items drawn and/or modified to precise angles and precise intervals of polar coordinates is described. Using the drawing tool and method, objects may be drawn or modified at precise angles and intervals in accordance with user settable parameters.

Abstract: Improvements are disclosed in a machine for applying carrier stock of resilient polymeric material to substantially identical containers, each having an upper rim of a given diameter and a side wall of a larger diameter. The carrier stock has container-receiving apertures in longitudinal rows. A conveyor conveys the containers in longitudinal rows. A wheel assembly comprising two wheels with paired jaws receives the stock, stretches the stock transversely, and moves the stock downwardly past the rims. The conveyor, the wheel assembly, and the jaws on one wheel are adjustable for applying the stock selectively in a rim-applied carrier position or in a side-applied carrier position. The conveyor is supported by a table and is adjustable vertically, via spacers insertable between the table and a base. The wheel assembly is adjustable longitudinally, via rollers on longitudinal rails. The jaws on one wheel are adjustable transversely, via screws.

Abstract: A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.

Abstract: A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.

Abstract: An integrated circuit component is attached to a printed circuit board by solder bump interconnections that are formed between metal bumps on the component and a metal-plated terminal on the board. The metal plate overlies both a bond pad and an adjacent runner of each terminal and is formed of a first metal, which is preferably a tin-base alloy. The metal bumps on the component are formed of a second metal, which is preferably an indium-base alloy. The component and board are assembled and heated to a temperature less than the melting temperatures of the first and second metals. At the interface between the bumps and the plate, the first and second metals cooperate to form a liquid phase which, upon cooling and solidifying, completes the interconnection.

Abstract: A method for forming a plurality of solder bumps on an electronic component substrate utilizes a transfer plate to electrodeposit solder deposits and subsequently reflow the deposits onto the substrate. The plate comprises discrete pad electrodes formed of a ceramic material that is suitably electrically conductive to permit electroplating of the solder alloy, but is not wet by the molten solder to permit reflow onto the substrate. A preferred electrode material is an indium oxide compound. The solder deposits are plated onto the electrodes, and the transfer plate is superposed on the substrate such that the bumps rest upon bond pads on the substrate. The assembly is heated and cooled to melt and resolidify the solder alloy, whereupon the solder bonds to the substrate pads to form the bumps.

Abstract: A method for forming a solder-bumped terminal on a planar dielectric substrate utilizes a terminal of a particular configuration and comprises depositing onto the terminal a thin plate of solder alloy and reflowing the solder alloy to form a bump. The terminal configuration includes an enlarged terminal pad connected to a relatively narrow linear runner section. Preferably, the runner section width is between about 50 and 150 microns, whereas the pad width is between about 1.2 and 2.0 times the runner section width. The terminal is initially fabricated to include a metal layer adjacent the substrate formed, for example, of copper and a thin, outer plate composed of the solder alloy. The solder plate is deposited in a uniform thickness to both the terminal pad and the adjacent runner section. The terminal is then heated to melt the solder plate, whereupon the molten solder is drawn from the runner onto the enlarged pad to form a bump.

Abstract: A method for forming a solder-bumped circuit trace on a planar dielectric substrate includes fabricating a trace having an intersection between linear section, depositing onto the trace a uniform thin plate of solder alloy and reflowing the solder alloy to form a bump at the intersection. More particularly, the trace comprises first and second linear sections that intersect at an angle between 45 degrees and 135 degrees and have widths preferably between 50 and 150 microns. The solder plate is deposited, preferably by electroplating, at a thickness between about 10 and 25 microns. Thereafter, when the trace is heated to melt the solder layer, the solder coalesces at the intersection to form the bump.

Abstract: A solder bump stretch device is disclosed for use in mounting an electronic component to a substrate by a plurality of solder bump interconnections that are produced by reflowing preformed solder bumps carried on the component. the device is fastened to the component, which is in turn assembled with the substrate so that the bumps rest upon the substrate in preparation for solder reflow operations. The device comprises a flexible web that overlies the component outer face and is connected to legs that depend about the component. Prior to solder reflow, the web is held by an expendable spacer in a biased position wherein the legs are raised apart from the substrate. During heating to melt the solder bumps, the spacer is expended, releasing the web, whereupon the legs engage the substrte to lift the component relative to the substrate and thereby stretch the molten solder to form elongated interconnections preferably having hourglass configurations.

Abstract: An improved method is provided for assembling an integrated circuit component to a substrate by a solder bump interconnection that is reinforced by a polymer film. The component is attached to a region of the substrate by a plurality of solder bump interconnections that create a gap between the component interface and the substrate region. A polymer dam is applied to the region encircling the attached component spaced apart therefrom. A liquid polymer precursor material is applied to the region including the gap and is confined by the dam to prevent indiscriminate flow across the substrate. In one aspect of this invention, gas is vented from the gap through a passage in the substrate to enhance fill by the precursor liquid. In another aspect of this invention, the precursor liquid is injected into the gap through a passage in the substrate and spread outwardly therefrom.

Abstract: An apparatus and method for assembling a plurality of articles with carriers in a connected carrier strip. The apparatus and method separates the strip of carriers assembled with a plurality of articles to form discrete packages of a plurality of articles by dividing the carrier strip horizontally tranversely to the path of travel of the articles and the assembled carrier strip. The portion of the apparatus for separating the articles is positionable between groups of articles moving along a path of travel and provides tensioning of the carrier strip between groups of articles to facilitate dividing the carrier strip along weakened lines.

Abstract: An article stack unifying device having article stacking elements is provided to stack a plurality of articles on a surface on or of a rotatable surface. While the articles are being stacked on the selected surface a quantity of wrapping film is wrapped around the stack of articles at intervals during the stacking process and at the completion of the stack.