Patents by Inventor Kevin D. Sisco

Kevin D. Sisco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210285076
    Abstract: Aluminum-copper-manganese-zirconium alloys for metal additive manufacturing include 5 wt % to 35 wt % copper, 0.05 wt % to 3 wt % manganese, 0.5 wt % to 5 wt % zirconium, 0 wt % to 3 wt % iron, and 0 wt % to less than 1 wt % silicon, with the balance being aluminum. The as-printed alloys may have a microstructure comprising ?? intermetallic precipitates having an average diameter of 0.1 ?m to 0.3 ?m, a microstructure comprising ? intermetallic particles having particle spacing of 50-500 nm with a volume fraction of 0-50%; a microstructure comprising a bimodal distribution of equiaxed grains and columnar grains, or any combination thereof. The as-printed alloys may exhibit superior mechanical properties compared to cast alloys with a similar composition.
    Type: Application
    Filed: March 1, 2021
    Publication date: September 16, 2021
    Inventors: Alexander J. Plotkowski, Sumit Bahl, Ryan R. Dehoff, James A. Haynes, Amit Shyam, Kevin D. Sisco, Ying Yang
  • Publication number: 20210130934
    Abstract: Disclosed herein are embodiments of an Al—Ce—Cu alloy for use in additive manufacturing. The disclosed alloy embodiments provide fabricated objects, such as bulk components, comprising a heterogeneous microstructure and having good mechanical properties even when exposed to conditions used during the additive manufacturing process. Methods for making and using alloy embodiments also are disclosed herein.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 6, 2021
    Inventors: Sumit Bahl, Ryan R. Dehoff, Hunter B. Henderson, Scott McCall, Ryan Ott, Alexander J. Plotkowski, Orlando Rios, Amit Shyam, Zachary C. Sims, Kevin D. Sisco, David Weiss, Ying Yang
  • Publication number: 20210129270
    Abstract: Disclosed herein are embodiments of an Al—Ce—Ni alloy for use in additive manufacturing. The disclosed alloy embodiments provide fabricated objects, such as bulk components, comprising a heterogeneous microstructure and having good mechanical properties even when exposed to conditions used during the additive manufacturing process. Methods for making and using alloy embodiments also are disclosed herein.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 6, 2021
    Inventors: Ryan R. Dehoff, Hunter B. Henderson, Scott McCall, Richard Michi, Peeyush Nandwana, Ryan Ott, Alexander J. Plotkowski, Orlando Rios, Amit Shyam, Zachary C. Sims, Kevin D. Sisco, David Weiss, Ying Yang