Abstract: A method for reliable, safe removal of an electrical or electronic component or device mounted on a fragile or brittle circuit board substrate having opposed planar upper and lower surfaces, e.g., for performing testing such as failure analysis, comprises sequential steps of cutting the substrate transversely through its thickness to separate therefrom a segment comprising a first portion including the component or device and a second, adjoining portion; cutting the separated segment longitudinally along a plane parallel to the upper surface, the cutting extending beneath the entirety of the first portion; and cutting the substrate of the separated segment transversely through its thickness to separate the first portion including the component or device from the second portion.