Abstract: The present invention relates to a composition for caring for and/or making up keratin materials, in particular the skin, comprising, preferably in a physiologically acceptable medium: a) at least one silicone elastomer containing carboxylic acid functions; and b) at least one copolymer based on silicone resin and on silicone of dimethiconol type. The invention also relates to a process for coating keratin materials, more particularly for making up and/or caring for keratin materials, such as the skin, characterized in that it comprises the application to keratin materials of an emulsion as defined above.

Abstract: A memory device includes a substrate, a controller die, a flip chip die, first and second silicon dies, and bond wires. The controller and flip chip dies are attached to the substrate using connection balls and in electrical communication with each other. The first and second silicon dies include respective first and second contact pad surfaces. The bond wires electrically connect the contact pad surfaces to the substrate so the first and second silicon dies communicate with the controller die. The flip chip die and first and second silicon dies are NAND dies, the flip chip die is configured as SLC memory, and the silicon dies are configured as one of MLC memory, TLC memory, or QLC memory.

Abstract: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.

Abstract: A memory device includes a substrate, a controller die, a flip chip die, first and second silicon dies, and bond wires. The controller and flip chip dies are attached to the substrate using connection balls and in electrical communication with each other. The first and second silicon dies include respective first and second contact pad surfaces. The bond wires electrically connect the contact pad surfaces to the substrate so the first and second silicon dies communicate with the controller die. The flip chip die and first and second silicon dies are NAND dies, the flip chip die is configured as SLC memory, and the silicon dies are configured as one of MLC memory, TLC memory, or QLC memory.

Abstract: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.

Abstract: Set forth herein are positive electrode active material compositions, e.g., lithium-rich nickel manganese cobalt oxides. The lithium-rich nickel manganese cobalt oxides set forth herein are characterized, in some examples, by an expanded unit cell which maximizes the uniform distribution of transition metals in the crystalline oxide. Also set forth herein are positive electrode thin films including lithium-rich nickel manganese cobalt oxide materials. Disclosed herein are novel and inventive methods of making and using lithium-rich nickel manganese cobalt oxide materials for lithium rechargeable batteries. Also disclosed herein are novel electrochemical devices which incorporate these materials.

Abstract: Set forth herein are positive electrode active material compositions, e.g., lithium-rich nickel manganese cobalt oxides. The lithium-rich nickel manganese cobalt oxides set forth herein are characterized, in some examples, by an expanded unit cell which maximizes the uniform distribution of transition metals in the crystalline oxide. Also set forth herein are positive electrode thin films including lithium-rich nickel manganese cobalt oxide materials. Disclosed herein are novel and inventive methods of making and using lithium-rich nickel manganese cobalt oxide materials for lithium rechargeable batteries. Also disclosed herein are novel electrochemical devices which incorporate these materials.