Patents by Inventor Kevin DUNAY

Kevin DUNAY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • In mold electronic printed circuit board encapsulation and assembly
    Patent number: 11112103
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: September 7, 2021
    Assignees: Covestro LLC, Thermal Solution Resources, LLC
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • IN MOLD ELECTRONIC PRINTED CIRCUIT BOARD ENCAPSULATION AND ASSEMBLY
    Publication number: 20190093874
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Application
    Filed: November 8, 2018
    Publication date: March 28, 2019
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • In mold electronic printed circuit board encapsulation and assembly
    Patent number: 10156352
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: December 18, 2018
    Assignees: COVESTRO LLC, THERMAL SOLUTION RESOURCES, LLC
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • IN MOLD ELECTRONIC PRINTED CIRCUIT BOARD ENCAPSULATION AND ASSEMBLY
    Publication number: 20160084490
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Application
    Filed: April 16, 2014
    Publication date: March 24, 2016
    Inventors: Terry G. DAVIS, David ROCCO, Mikhail SAGAL, Jessee MCCANNA, Nicolas SUNDERLAND, James LORENZO, Mark MATSCO, Kevin DUNAY