Patents by Inventor Kevin E. Craig
Kevin E. Craig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11573054Abstract: Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.Type: GrantFiled: November 5, 2019Date of Patent: February 7, 2023Assignee: CommScope Technologies LLCInventor: Kevin E. Craig
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Patent number: 11239886Abstract: MIMO antenna modules and antenna units for a wireless communication system are provided. In one embodiment, a remote unit comprises: a controller module, comprising: a first substrate having a first ground plane, control circuitry and interface circuitry on the first substrate, a first connection region formed in the first substrate; and at least one antenna module coupled to the controller module, the antenna module comprising: a second substrate having a second ground plane, antennas on the second substrate, a second connection region on the second substrate and coupled to the interface circuitry via the first connection region, wherein the second connection region communicates data between the interface circuitry and the antennas, and a set of ground-plane contacts on the second substrate that electrically couple the first ground plane to the second ground plane of the second substrate when the second connector region is engaged with the first connector region.Type: GrantFiled: February 16, 2021Date of Patent: February 1, 2022Assignee: CommScope Technologies LLCInventors: Michael Pollman, Kevin E. Craig, David Davies
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Publication number: 20210167818Abstract: MIMO antenna modules and antenna units for a wireless communication system are provided. In one embodiment, a remote unit comprises: a controller module, comprising: a first substrate having a first ground plane, control circuitry and interface circuitry on the first substrate, a first connection region formed in the first substrate; and at least one antenna module coupled to the controller module, the antenna module comprising: a second substrate having a second ground plane, antennas on the second substrate, a second connection region on the second substrate and coupled to the interface circuitry via the first connection region, wherein the second connection region communicates data between the interface circuitry and the antennas, and a set of ground-plane contacts on the second substrate that electrically couple the first ground plane to the second ground plane of the second substrate when the second connector region is engaged with the first connector region.Type: ApplicationFiled: February 16, 2021Publication date: June 3, 2021Applicant: CommScope Technologies LLCInventors: Michael Pollman, Kevin E. Craig, David Davies
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Patent number: 10958312Abstract: An embodiment of an antenna module includes a substrate, a first antenna, and a second antenna. The first antenna is disposed on the substrate and is configured to radiate a first signal having a wavelength and a first polarization. And the second antenna is disposed on the substrate and is configured to radiate a second signal having the wavelength and a second polarization that is approximately orthogonal to the first polarization. For example, such an antenna module can include, as the first antenna, a T antenna configured to transmit and receive data that forms a first part of a MIMO-OFDM data symbol, and can include, as the second antenna, an F antenna configured to transmit and receive data that forms a second part of the MIMO-OFDM data symbol.Type: GrantFiled: February 27, 2019Date of Patent: March 23, 2021Assignee: CommScope Technologies LLCInventors: Michael Pollman, Kevin E. Craig, David Davies, Stephen Ledingham
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Patent number: 10833734Abstract: An embodiment of an antenna module includes a substrate, a first antenna, and a second antenna. The first antenna is disposed on the substrate and is configured to radiate a first signal having a wavelength and a first polarization. And the second antenna is disposed on the substrate and is configured to radiate a second signal having the wavelength and a second polarization that is approximately orthogonal to the first polarization. For example, such an antenna module can include, as the first antenna, a T antenna configured to transmit and receive data that forms a first part of a MIMO-OFDM data symbol, and can include, as the second antenna, an F antenna configured to transmit and receive data that forms a second part of the MIMO-OFDM data symbol.Type: GrantFiled: February 27, 2019Date of Patent: November 10, 2020Assignee: CommScope Technologies LLCInventors: Michael Pollman, Kevin E. Craig, David Davies
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Publication number: 20200191498Abstract: Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.Type: ApplicationFiled: November 5, 2019Publication date: June 18, 2020Applicant: CommScope Technologies LLCInventor: Kevin E. Craig
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Publication number: 20190268045Abstract: An embodiment of an antenna module includes a substrate, a first antenna, and a second antenna. The first antenna is disposed on the substrate and is configured to radiate a first signal having a wavelength and a first polarization. And the second antenna is disposed on the substrate and is configured to radiate a second signal having the wavelength and a second polarization that is approximately orthogonal to the first polarization. For example, such an antenna module can include, as the first antenna, a T antenna configured to transmit and receive data that forms a first part of a MIMO-OFDM data symbol, and can include, as the second antenna, an F antenna configured to transmit and receive data that forms a second part of the MIMO-OFDM data symbol.Type: ApplicationFiled: February 27, 2019Publication date: August 29, 2019Applicant: CommScope Technologies LLCInventors: Michael Pollman, Kevin E. Craig, David Davies
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Patent number: 5256203Abstract: Apparatus for applying an anaerobic adhesive to the inside of the necks of cartridge cases preparatory to insertion of bullets therein to provide a seal between the inside of the necks and the bullets, the cases being held standing on end, mouth end up, in a holder arranged in a rank and file format, the holder being indexed to bring successive rows of cases under a set of adhesive dispensing nozzles which are lowered for entry of the tips of the nozzles into the upper ends of the cases in a row.Type: GrantFiled: August 26, 1991Date of Patent: October 26, 1993Assignee: Thomas B. Moore Co. Inc.Inventors: Thomas B. Moore, Kevin E. Craig, Gerard J. Gragnani