Patents by Inventor Kevin E. Craig

Kevin E. Craig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11573054
    Abstract: Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: February 7, 2023
    Assignee: CommScope Technologies LLC
    Inventor: Kevin E. Craig
  • Patent number: 11239886
    Abstract: MIMO antenna modules and antenna units for a wireless communication system are provided. In one embodiment, a remote unit comprises: a controller module, comprising: a first substrate having a first ground plane, control circuitry and interface circuitry on the first substrate, a first connection region formed in the first substrate; and at least one antenna module coupled to the controller module, the antenna module comprising: a second substrate having a second ground plane, antennas on the second substrate, a second connection region on the second substrate and coupled to the interface circuitry via the first connection region, wherein the second connection region communicates data between the interface circuitry and the antennas, and a set of ground-plane contacts on the second substrate that electrically couple the first ground plane to the second ground plane of the second substrate when the second connector region is engaged with the first connector region.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: February 1, 2022
    Assignee: CommScope Technologies LLC
    Inventors: Michael Pollman, Kevin E. Craig, David Davies
  • Publication number: 20210167818
    Abstract: MIMO antenna modules and antenna units for a wireless communication system are provided. In one embodiment, a remote unit comprises: a controller module, comprising: a first substrate having a first ground plane, control circuitry and interface circuitry on the first substrate, a first connection region formed in the first substrate; and at least one antenna module coupled to the controller module, the antenna module comprising: a second substrate having a second ground plane, antennas on the second substrate, a second connection region on the second substrate and coupled to the interface circuitry via the first connection region, wherein the second connection region communicates data between the interface circuitry and the antennas, and a set of ground-plane contacts on the second substrate that electrically couple the first ground plane to the second ground plane of the second substrate when the second connector region is engaged with the first connector region.
    Type: Application
    Filed: February 16, 2021
    Publication date: June 3, 2021
    Applicant: CommScope Technologies LLC
    Inventors: Michael Pollman, Kevin E. Craig, David Davies
  • Patent number: 10958312
    Abstract: An embodiment of an antenna module includes a substrate, a first antenna, and a second antenna. The first antenna is disposed on the substrate and is configured to radiate a first signal having a wavelength and a first polarization. And the second antenna is disposed on the substrate and is configured to radiate a second signal having the wavelength and a second polarization that is approximately orthogonal to the first polarization. For example, such an antenna module can include, as the first antenna, a T antenna configured to transmit and receive data that forms a first part of a MIMO-OFDM data symbol, and can include, as the second antenna, an F antenna configured to transmit and receive data that forms a second part of the MIMO-OFDM data symbol.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: March 23, 2021
    Assignee: CommScope Technologies LLC
    Inventors: Michael Pollman, Kevin E. Craig, David Davies, Stephen Ledingham
  • Patent number: 10833734
    Abstract: An embodiment of an antenna module includes a substrate, a first antenna, and a second antenna. The first antenna is disposed on the substrate and is configured to radiate a first signal having a wavelength and a first polarization. And the second antenna is disposed on the substrate and is configured to radiate a second signal having the wavelength and a second polarization that is approximately orthogonal to the first polarization. For example, such an antenna module can include, as the first antenna, a T antenna configured to transmit and receive data that forms a first part of a MIMO-OFDM data symbol, and can include, as the second antenna, an F antenna configured to transmit and receive data that forms a second part of the MIMO-OFDM data symbol.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 10, 2020
    Assignee: CommScope Technologies LLC
    Inventors: Michael Pollman, Kevin E. Craig, David Davies
  • Publication number: 20200191498
    Abstract: Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.
    Type: Application
    Filed: November 5, 2019
    Publication date: June 18, 2020
    Applicant: CommScope Technologies LLC
    Inventor: Kevin E. Craig
  • Publication number: 20190268045
    Abstract: An embodiment of an antenna module includes a substrate, a first antenna, and a second antenna. The first antenna is disposed on the substrate and is configured to radiate a first signal having a wavelength and a first polarization. And the second antenna is disposed on the substrate and is configured to radiate a second signal having the wavelength and a second polarization that is approximately orthogonal to the first polarization. For example, such an antenna module can include, as the first antenna, a T antenna configured to transmit and receive data that forms a first part of a MIMO-OFDM data symbol, and can include, as the second antenna, an F antenna configured to transmit and receive data that forms a second part of the MIMO-OFDM data symbol.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 29, 2019
    Applicant: CommScope Technologies LLC
    Inventors: Michael Pollman, Kevin E. Craig, David Davies
  • Patent number: 5256203
    Abstract: Apparatus for applying an anaerobic adhesive to the inside of the necks of cartridge cases preparatory to insertion of bullets therein to provide a seal between the inside of the necks and the bullets, the cases being held standing on end, mouth end up, in a holder arranged in a rank and file format, the holder being indexed to bring successive rows of cases under a set of adhesive dispensing nozzles which are lowered for entry of the tips of the nozzles into the upper ends of the cases in a row.
    Type: Grant
    Filed: August 26, 1991
    Date of Patent: October 26, 1993
    Assignee: Thomas B. Moore Co. Inc.
    Inventors: Thomas B. Moore, Kevin E. Craig, Gerard J. Gragnani