Patents by Inventor Kevin E. Warheit

Kevin E. Warheit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for reconditioning a used ammoniacal copper etching solution containing copper solute
    Patent number: 4490224
    Abstract: Ammoniacal solutions that have been employed in a bath for etching copper such as in the manufacture of printed circuits is reconstituted or regenerated to substantially fully remove copper solute therefrom and retain the ammonia content thereof in such a manner as to enable a continuous reuse of the etching solution. The process is conducted in such a manner that no contaminating metal powder, compounds or sludge are formed. The reconditioning is effected by introducing used ammonia solute containing ammonium etching solution into an electrolytic bath in which cathodic and anodic electrode containing compartments are defined by a cationic permeable membrane therebetween with the cathodic compartment having an electronegative cathode electrode plate therein.
    Type: Grant
    Filed: April 16, 1984
    Date of Patent: December 25, 1984
    Assignee: Lancy International, Inc.
    Inventor: Kevin E. Warheit
  • Palladium boron plates by electroless deposition alloy
    Patent number: 4341846
    Abstract: A bath for the electroless deposition of palladium boron comprises an aqueous solution of divalent palladium, ammonia or amine, and a tertiary amine borane. The bath may contain thio-organic, iminonitrile or other stabilizers. A hard palladium alloy is plated, having the composition of 1-3% amorphous borone, 1-3% crystalline PdH.sub.0.706, the remainder amorphous palladium. A strong laminate is formed when the alloy is plated on electroless nickel.
    Type: Grant
    Filed: February 2, 1981
    Date of Patent: July 27, 1982
    Assignee: Mine Safety Appliances Company
    Inventors: William V. Hough, John L. Little, Kevin E. Warheit
  • Method for the electroless deposition of palladium
    Patent number: 4279951
    Abstract: A bath for the electroless deposition of palladium comprises an aqueous solution of divalent palladium, ammonia or amine, and a tertiary amine borane. The bath may contain thio-organic, iminonitrile or other stabilizers. A hard palladium alloy is plated, having the composition of 1-3% amorphous borone, 1-3% crystalline PdH.sub.0.706, the remainder amorphous palladium. A strong laminate is formed when the alloy is plated on electroless nickel.
    Type: Grant
    Filed: July 3, 1980
    Date of Patent: July 21, 1981
    Assignee: Mine Safety Appliances Company
    Inventors: William V. Hough, John L. Little, Kevin E. Warheit
  • Palladium alloy baths for the electroless deposition
    Patent number: 4255194
    Abstract: A bath for the electroless deposition of palladium comprises an aqueous solution of divalent palladium, ammonia or amine, and a tertiary amine borane. The bath may contain thio-organic, iminonitrile or other stabilizers. A hard palladium alloy is plated, having the composition of 1-3% amorphous borone, 1-3% crystalline PdH.sub.0.706, the remainder amorphous palladium. A strong laminate is formed when the alloy is plated on electroless nickel.
    Type: Grant
    Filed: January 15, 1979
    Date of Patent: March 10, 1981
    Assignee: Mine Safety Appliances Company
    Inventors: William V. Hough, John L. Little, Kevin E. Warheit