Patents by Inventor Kevin F. Casey

Kevin F. Casey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9379468
    Abstract: An apparatus includes a first electrical connector including a first housing, a contact element having a first portion connected to the first housing, and a first elastic element for supporting the first portion in the first housing. The first elastic element is deflectable to permit the contact element to move relative to the first housing. The apparatus also includes a second electrical connector including a second housing and a second elastic element that is deflectable to receive and retain a second portion of the contact element that protrudes from the first housing.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: June 28, 2016
    Assignee: Cisco Technology, Inc.
    Inventors: Christopher E. Zieman, Kevin F. Casey
  • Publication number: 20140120760
    Abstract: An apparatus includes a first electrical connector including a first housing, a contact element having a first portion connected to the first housing, and a first elastic element for supporting the first portion in the first housing. The first elastic element is deflectable to permit the contact element to move relative to the first housing. The apparatus also includes a second electrical connector including a second housing and a second elastic element that is deflectable to receive and retain a second portion of the contact element that protrudes from the first housing.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 1, 2014
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: CHRISTOPHER E. ZIEMAN, KEVIN F. CASEY
  • Patent number: 6924437
    Abstract: A circuit board assembly includes a circuit board which defines circuit board pads, a set of surface mount electronic components soldered to a first set of the circuit board pads using a surface mount soldering process, and a set of surface mount coupling devices soldered to a second set of the circuit board pads using the surface mount soldering process. Each surface mount coupling device is configured to couple at least a portion of an object to the circuit board. Each surface mount coupling device includes a set of surface mount pads connected to the second set of the circuit board pads by solder joints resulting from the surface mount soldering process, a set of legs extending from the set of surface mount pads, and a body portion connected to the set of legs, the body portion providing a fixed structure relative to the circuit board for securing the object.
    Type: Grant
    Filed: April 10, 2003
    Date of Patent: August 2, 2005
    Assignee: Cisco Technology, Inc.
    Inventors: Norman L. Creekmore, Kevin F. Casey, Troy Williams Glover, Robert Gregory Twiss