Patents by Inventor Kevin Formosa

Kevin Formosa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • REMOVABLE WAFER EXPANDER FOR DIE BONDING EQUIPMENT
    Publication number: 20080032489
    Abstract: A removable wafer expander for die bonding equipment for a singularized wafer supported by a flexible sticky substrate, the removable wafer expander provided with a first ring member to be coupled with a second ring member for remote expansion of the flexible sticky substrate therebetween before the mounting of the wafer expander onto the die bonding equipment.
    Type: Application
    Filed: August 3, 2007
    Publication date: February 7, 2008
    Applicant: STMICROELECTRONICS LTD.
    Inventor: Kevin Formosa