Patents by Inventor Kevin G. Donovan

Kevin G. Donovan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6643048
    Abstract: An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected with resistive layers on a surface of the optical modulator chip.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: November 4, 2003
    Assignee: Codeon Corporation
    Inventors: Ganesh K. Gopalakrishnan, Kevin G. Donovan, Richard C. Blanchard
  • Publication number: 20020105714
    Abstract: An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected on a surface of the optical modulator chip.
    Type: Application
    Filed: February 8, 2001
    Publication date: August 8, 2002
    Applicant: Codeon Corporation
    Inventors: Ganesh K. Gopalakrishnan, Kevin G. Donovan, Richard C. Blanchard
  • Patent number: 6429959
    Abstract: An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected on a surface of the optical modulator chip.
    Type: Grant
    Filed: February 8, 2001
    Date of Patent: August 6, 2002
    Assignee: Codeon Corporation
    Inventors: Ganesh K. Gopalakrishnan, Kevin G. Donovan, Richard C. Blanchard
  • Publication number: 20020054417
    Abstract: An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected with resistive layers on a surface of the optical modulator chip.
    Type: Application
    Filed: June 21, 2001
    Publication date: May 9, 2002
    Applicant: Codeon Corporation
    Inventors: Ganesh K. Gopalakrishnan, Kevin G. Donovan, Richard C. Blanchard