Patents by Inventor Kevin G. Nelson

Kevin G. Nelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7981504
    Abstract: The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and/or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately ?200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: July 19, 2011
    Inventor: Kevin G. Nelson
  • Publication number: 20110149528
    Abstract: The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and/or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately ?200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects.
    Type: Application
    Filed: January 15, 2009
    Publication date: June 23, 2011
    Inventor: Kevin G. Nelson
  • Publication number: 20100136223
    Abstract: The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and/or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately ?200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects.
    Type: Application
    Filed: December 22, 2009
    Publication date: June 3, 2010
    Inventor: Kevin G. NELSON
  • Patent number: 7498392
    Abstract: The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and/or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately ?200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects.
    Type: Grant
    Filed: April 13, 2006
    Date of Patent: March 3, 2009
    Inventor: Kevin G. Nelson
  • Publication number: 20020107331
    Abstract: The present invention provides fluoropolymer powders having a diameter of from about 0.05 to about 200 microns, said powders having pendant hydrophilic groups and olefinic unsaturation. The powders are useful in applications which require a hydrophilic form of a fluropolymer powder such as poly(tetrafluoroethylene), such as a binder component in inks and coatings, or as components for paste extrusion or as components of composite materials.
    Type: Application
    Filed: December 11, 2000
    Publication date: August 8, 2002
    Inventors: Amir James Attar, Kevin G. Nelson
  • Patent number: 4893591
    Abstract: A manifold flame arrestor system for use with an internal combustion engine having a plurality of cylinders, each cylinder having an intake port and means of ignition of combustible mixtures drawn into the cylinder through the intake port, and an intake manifold connecting the intake ports of a plurality of cylinders, the system serving to reduce the possibility of transmission of combustion producing flame from a cylinder into the intake manifold comprising a flame arrestor positioned between the intake manifold and each cylinder intake port, each flame arrestor permitting passage of combustible mixtures therethrough but prohibiting the passage of flame therethrough.
    Type: Grant
    Filed: September 22, 1988
    Date of Patent: January 16, 1990
    Assignee: Facet Enterprises, Inc.
    Inventor: Kevin G. Nelson
  • Patent number: 4744857
    Abstract: The present invention provides etched fluoropolymer fibers and a method for etching fluoropolymer fibers, which are then capable of being boned either together or with other materials to form composite materials. In particle, the present invention relates to a method for chemically etching chopped, natural polytetrafluoroethylene fiber by immersing the fibers in an alkai metal polyaryl hydrocarbon etching solution with increased temperatures ranging from 50.degree. C. to 110.degree. C. and high shearing agitation until at least 98% of the fibers are sufficiently hydrophilic to sink when placed in water. This produces etched fiber material which may then be bonded together to form composite fluoropolymer products.
    Type: Grant
    Filed: October 23, 1986
    Date of Patent: May 17, 1988
    Assignee: Acton Associates, Inc.
    Inventor: Kevin G. Nelson