Abstract: A buffer device for testing a memory subsystem. The buffer device includes a parallel bus port adapted for connection to a slow speed bus and a serial bus port adapted for connection to a high speed bus. The high speed bus operates at a faster speed than the slow speed bus. The buffer device also includes a bus converter having a standard operating mode for converting serial packetized input data received via the serial bus port into parallel bus output data for output via the parallel bus port. The buffer device also includes an alternate operating mode for converting parallel bus input data received via the parallel bus port into serial packetized output data for output via the serial bus port. The serial packetized input data is consistent in function and timing to the serial packetized output data.

Abstract: A buffered memory module including a downstream buffer, a downstream receiver, an upstream driver, an upstream receiver. The downstream buffer and the downstream receiver are both adapted for connection to a downstream memory bus in a packetized cascaded interconnect memory subsystem. The upstream driver and the upstream receiver are both adapted for connection to an upstream memory bus in the memory subsystem. During a test of the memory module, the upstream driver is connected to the downstream receiver and the downstream driver is connected to the upstream receiver. The memory module also includes one or more storage registers, a microprocessor and a service interface port. The microprocessor includes instructions for executing the test of the memory module including storing results of the test in the storage registers. The service interface port receives service interface signals that initiate the execution of the test and accesses the storage registers to determine the results of the test.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A memory subsystem with a memory bus and a memory assembly. The memory bus includes multiple bitlanes. The memory assembly is in communication with the memory bus and includes instructions for receiving an error code correction (ECC) word in multiple packets via the memory bus. The ECC word includes data bits and ECC bits arranged into multiple multi-bit ECC symbols. Each of the ECC symbols is associated with one of the bitlanes on the memory bus. The memory assembly also includes instructions for utilizing one of the ECC symbols to perform error detection and correction for the bits in the ECC word received via the bitlane associated with the ECC symbol.

Abstract: A memory subsystem with a memory bus and a memory assembly. The memory bus includes multiple bitlanes. The memory assembly is in communication with the memory bus and includes instructions for receiving an error code correction (ECC) word in multiple packets via the memory bus. The ECC word includes data bits and ECC bits arranged into multiple multi-bit ECC symbols. Each of the ECC symbols is associated with one of the bitlanes on the memory bus. The memory assembly also includes instructions for utilizing one of the ECC symbols to perform error detection and correction for the bits in the ECC word received via the bitlane associated with the ECC symbol.

Abstract: A cascaded interconnect system with one or more memory modules, a memory controller and a memory bus that utilizes periodic recalibration. The memory modules and the memory controller are directly interconnected by a packetized multi-transfer interface via the memory bus and provide scrambled data for use in the periodic recalibration.

Abstract: A cascaded interconnect system with one or more memory modules, a memory controller and a memory bus that utilizes periodic recalibration. The memory modules and the memory controller are directly interconnected by a packetized multi-transfer interface via the memory bus and provide scrambled data for use in the periodic recalibration.

Abstract: A cascaded interconnect system including a memory controller, one or more memory modules, an upstream memory bus and a downstream memory bus. The one or more memory modules include a first memory module with cache data. The memory modules and the memory controller are interconnected by a packetized multi-transfer interface via the downstream memory bus and the upstream memory bus. The first memory module and the memory controller are in direct communication via the upstream memory bus and the downstream memory bus.

Abstract: A cascaded interconnect system including a memory controller, one or more memory modules, an upstream memory bus and a downstream memory bus. The one or more memory modules include a first memory module with cache data. The memory modules and the memory controller are interconnected by a packetized multi-transfer interface via the downstream memory bus and the upstream memory bus. The first memory module and the memory controller are in direct communication via the upstream memory bus and the downstream memory bus.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A memory subsystem with a memory bus and a memory assembly. The memory bus includes multiple bitlanes. The memory assembly is in communication with the memory bus and includes instructions for receiving an error code correction (ECC) word in multiple packets via the memory bus. The ECC word includes data bits and ECC bits arranged into multiple multi-bit ECC symbols. Each of the ECC symbols is associated with one of the bitlanes on the memory bus. The memory assembly also includes instructions for utilizing one of the ECC symbols to perform error detection and correction for the bits in the ECC word received via the bitlane associated with the ECC symbol.

Abstract: A memory system including a first memory subsystem having a buffer device with a first port and a second port, one or more memory devices coupled to the buffer device via the second port, and a first two-on-one link for coupling to a memory controller for providing communication between the buffer device and the memory controller. The first two-on-one link is coupled to the first port of the buffer device. The first memory subsystem is configured to transfer data between at least one memory device of the one or more memory devices and the memory controller via the buffer device. The first two-on-one link includes up to two transceivers connected to a single link, with at least one of the up to two transceivers consisting of any one of two or more transmitters for transmitting signals or two or more receivers for receiving signals.

Abstract: A system for implementing a memory subsystem command interface, the system including a cascaded interconnect system including one or more memory modules, a memory controller and a memory bus. The memory controller generates a data frame that includes a plurality of commands. The memory controller and the memory module are interconnected by a packetized multi-transfer interface via the memory bus and the frame is transmitted to the memory modules via the memory bus.

Abstract: A method and system for providing frame start indication in a memory system having indeterminate read data latency. The method includes receiving a data transfer and determining if the data transfer includes a frame start indicator. The method also includes capturing the data transfer and “n” subsequent data transfers in response to determining that the data transfer includes a frame start indicator. The data transfer and the “n” subsequent data transfers comprise a data frame.

Abstract: A method and system for providing identification tags in a memory system having indeterminate data response times. An exemplary embodiment includes a memory controller in a memory system. The memory controller includes a mechanism for receiving data packets via an upstream channel, the data packets including upstream identification tags. The memory controller also includes a mechanism having instructions for facilitating determining if a received data packet is in response to a request from the memory controller. Input to the determining includes an upstream identification tag included in the received data packet. If the received data packet is determined to be in response to a request from the memory controller, then the received data packet is matched to the request, thereby allowing the memory controller to operate with indeterminate data response times.

Abstract: A dual inline memory module (DIMM) includes a card having a length of about 151.2 to about 151.5 millimeters, a plurality of individual local memory devices attached to the card, and a buffer device attached to the card, the buffer device configured for converting a packetized memory interface. The card includes at least 276 pins configured thereon including a plurality of high-speed bus interface pills arranged on said card for communicating with a plurality of high-speed busses. The high-speed bus interface pins associated with a single high-speed bus are located on one side of the card with respect to a midpoint of the length of the card, thus the pin assignments are defined such that the performance of the DIMM in a system is optimized for high frequency operation.

Abstract: A packetized cascade memory system including a plurality of memory assemblies, a memory bus including multiple segments, a bus repeater module and a segment level sparing module. The bus repeater module is in communication with two or more of the memory assemblies via the memory bus. The segment level sparing module provides segment level sparing for the communication bus upon segment failure.

Abstract: A high reliability dual inline memory module with a fault tolerant address and command bus for use in a server. The memory module is a card approximately 151.35 mm or 5.97 inches long provided with about a plurality of contacts of which some are redundant, a plurality of DRAMs, a phase lock loop, a 2 or 32K bit serial EE PROM and a 28 bit and a 1 to 2 register having error correction code (ECC), parity checking, a multi-byte fault reporting circuitry for reading via an independent bus, and real time error lines for determining and reporting both correctable errors and uncorrectable error conditions coupled to the server's memory interface chip and memory controller or processor such that the memory controller sends address and command information to the register via address/command lines together with check bits for error correction purposes to the ECC/Parity register.

Abstract: A high reliability dual inline memory module with a fault tolerant address and command bus for use in a server. The memory module is a card approximately 151.35 mm or 5.97 inches long provided with about a plurality of contacts of which some are redundant, a plurality of DRAMs, a phase lock loop, a 2 or 32K bit serial EE PROM and a 28 bit and a 1 to 2 register having error correction code (ECC), parity checking, a multi-byte fault reporting circuitry for reading via an independent bus, and real time error lines for determining and reporting both correctable errors and uncorrectable error conditions coupled to the server's memory interface chip and memory controller or processor such that the memory controller sends address and command information to the register via address/command lines together with check bits for error correction purposes to the ECC/ Parity register.

Abstract: A high reliability dual inline memory module with a fault tolerant address and command bus for use in a server. The memory module is a card approximately 151.35 mm or 5.97 inches long provided with about a plurality of contacts of which some are redundant, a plurality of DRAMs, a phase lock loop, a 2 or 32K bit serial EE PROM and a 28 bit and a 1 to 2 register having error correction code (ECC), parity checking, a multi-byte fault reporting circuitry for reading via an independent bus, and real time error lines for determining and reporting both correctable errors and uncorrectable error conditions coupled to the server's memory interface chip and memory controller or processor such that the memory controller sends address and command information to the register via address/command lines together with check bits for error correction purposes to the ECC/ Parity register.