Abstract: Example embodiments relate to a method and apparatus for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously, to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method may include depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path to attain the apparatus. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.

Abstract: Example embodiments relate to a method and apparatus for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously, to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method may include depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path to attain the apparatus. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.

Abstract: Disclosed is a method for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method includes depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.

Abstract: An in-situ method for repairing a thermal barrier coating deposited on a component that has suffered localized spallation including depositing a ceramic paste on a surface area of the component exposed by the localized spallation, the ceramic paste including a ceramic material in a binder material, the ceramic material including solid zirconia particles, the binder material including a silicone compound. The method also including heating the binder material to yield a repair coating that covers the surface area of the component, the silicone compound promoting the bonding of the solid zirconia particles.

Abstract: An in-situ method for repairing a thermal barrier coating deposited on a component that has suffered localized spallation including depositing a ceramic paste on a surface area of the component exposed by the localized spallation, the ceramic paste including a ceramic material in a binder material, the ceramic material including solid zirconia particles, the binder material including a silicone compound. The method also including heating the binder material to yield a repair coating that covers the surface area of the component, the silicone compound promoting the bonding of the solid zirconia particles.

Abstract: An in-situ method for repairing a thermal barrier coating deposited on a component that has suffered localized spallation including depositing a ceramic paste on a surface area of the component exposed by the localized spallation, the ceramic paste including a ceramic material in a binder material, the ceramic material including solid zirconia particles, the binder material including a silicone compound. The method also including heating the binder material to yield a repair coating that covers the surface area of the component, the silicone compound promoting the bonding of the solid zirconia particles.