Abstract: A manual spray dispenser for dispensing a mixture of two compositions comprises a container having a first and second chamber and a single dispensing spray outlet. At least one of the chambers has a separator in the form of a pouch for physically separating the contents of the container from an interior surface of the chamber. One of the first and second chambers contains a first composition and the other contains a second composition. The dispenser further contains a dispensing system for simultaneously dispensing the first composition and the second composition, mixing the two compositions together, and dispensing a mixture of the two compositions from the container under pressure. An aerosol propellant is between the separator and the interior surface of the at least one of the first and second chambers for pressurizing the composition in the pouch for dispensing the contents thereof through the dispensing system under pressure.

Abstract: A surface treating implement (10) according to the invention comprises a body (14) comprising a container receiver (36) and a nozzle assembly (26) comprising a fluid conduit fluidly (72) connected to the container receiver (36). At least one container (16) is selectively mounted to the container receiver (36) and contains a predetermined amount of a treating composition and has a dispensing opening (102) in fluid communication with the fluid conduit (72). A handle (12) is associated with the body (14). The nozzle assembly (26) is mounted to the body (14) for selective displacement a predetermined distance to release the treating composition from the container (16) through the fluid conduit (72) and onto a surface to be treated.

Abstract: A manual spray dispenser for dispensing a mixture of two compositions comprises a container having a first and second chamber and a single dispensing spray outlet for dispensing controlled amounts of liquids from each of the first and second chambers. At least one of the chambers has a separator in the form of a pouch for physically separating the contents of the container from an interior surface of the chamber. The first chamber can contain a first composition and the second chamber can contain a second composition having a reactive component that reacts with at least one compound upon contact or mixing. The dispenser further contains a dispensing system for simultaneously dispensing the first composition and the second composition from their respective first and second chambers, mixing the two compositions together, and dispensing a mixture of the two compositions from the container under pressure.

Abstract: A kit and method for preparing a cleaning solution for delivery under pressure includes combining a cleaning composition, an oxidizing agent, an effervescent agent and an aqueous medium in a pressurizable container having an opening with a removably mounted cap. The effervescent agent reacts with the aqueous medium to generate a gas to pressurize the cleaning solution within the container. The method can be used for preparing a cleaning solution for use with a pressurizable container have an aerosol valve assembly or an extraction cleaner with a fluid delivery system for dispensing the cleaning solution under pressure to a surface to be cleaned. The cleaning solution and a pressurizable container having a removably mounted cap with an aerosol valve assembly can be provided as a kit to a consumer for preparing a pressurized cleaning solution.

Abstract: A manual spray dispenser for dispensing a mixture of two compositions comprises a container having a first and second chamber and a single dispensing spray outlet for dispensing controlled amounts of liquids from each of the first and second chambers. At least one of the chambers has a separator in the form of a pouch for physically separating the contents of the container from an interior surface of the chamber. The first chamber can contain a first composition and the second chamber can contain a second composition having a reactive component that reacts with at least one compound upon contact or mixing. The dispenser further contains a dispensing system for simultaneously dispensing the first composition and the second composition from their respective first and second chambers, mixing the two compositions together, and dispensing a mixture of the two compositions from the container under pressure.

Abstract: Systems and methods relate to frequency of advertisement viewing on the Internet, and more specifically to controlling advertisement viewings by a person during an advertising cycle. A probability of return for a customer is evaluated and an advertisement is shown to the customer based on a function of at least the probability of return and a value for the return. Once the customer has seen the advertisement a target number of times, the customer is no longer shown the advertisement.

Abstract: A computer system, such as a notebook computer, that includes a lid having integrated circuit components that require heat dissipation while protecting the screen display of the lid.

Abstract: A computer system, such as a notebook computer, that includes a lid having integrated circuit components that require heat dissipation while protecting the screen display of the lid.

Abstract: An apparatus and method for removing heat from a heat generating component located within a thin-profile consumer electronic or computer system enclosure is disclosed. In one embodiment the cooling system of the present invention includes an air duct comprising a thermally conductive housing having internal fins dispersed along the internal walls of the duct. An air flow generator produces an air flow that is directed from an inlet port located at or near the center of the air duct to first and second exit ports located at opposite ends of the duct. A low resistance thermal path, such as a heat pipe, transfers heat from the heat generating component to the air duct housing.

Abstract: A printed circuit board assembly that has a heatpipe. The assembly includes an integrated circuit package that is mounted to a printed circuit board. The heatpipe is attached to a plastic mold that is mounted to the printed circuit board. When assembled to the circuit board, the heatpipe is thermally coupled to the integrated circuit package. The plastic mold is lightweight and relatively inexpensive to produce. The mold also provides enough structural rigidity to prevent warping of the heatpipe.

Abstract: A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edge. A heat exchange sheath is mounted substantially parallel to the first and second edges and defines a first opening and a second opening. A first heat pipe is thermally coupled to the integrated circuit and has a portion disposed within the first opening. A second heat pipe is coupled to the display housing and has a portion disposed within the second housing. Alternately, the first heat pipe is coupled to the first hinged member and has a first portion substantially parallel to the first edge and the second edge. In this case, the second heat pipe is coupled to the second hinged member and has a first portion substantially perpendicular to the first heat pipe as well as a second portion conformally engaging the first heat pipe.

Abstract: A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edges. A heat exchange sheath is mounted substantially parallel to the first and second edges and defines a first opening and a second opening. A first heat pipe is thermally coupled to the integrated circuit and has a portion disposed within the first opening. A second heat pipe is coupled to the display housing and has a portion disposed within the second opening. Alternately, the first heat pipe is coupled to the first hinged member and has a first portion substantially parallel to the first edge and the second edge. In this case, the second heat pipe is coupled to the second hinged member and has a first portion substantially perpendicular to the first heat pipe as well as a second portion conformally engaging the first heat pipe.

Abstract: A heat transfer apparatus providing thermal coupling between a first and a second hinged member. The first hinged member is a first computer housing member, and the second hinged member is a second computer housing member. The first and the second computer housing members are rotatably attached allowing pivotal motion along an axis substantially parallel to the first edge. A first embodiment has a spiraled heat transfer element with a inner edge thermally coupled to a heat conductive mounting element mounted along the first edge of the first computer housing member. The spiraled heat transfer element forms at least one turn around the heat conductive mounting element and has outer edge affixed to the second computer housing member. A second embodiment provides heat transfer between the first and second computer housing members through the gudgeon and the pintle of the hinge.

Abstract: A surface mount package for an electronic device has an array of solder shapes or structures projecting from the bottom surface of the package. The solder structures are cast in place on the package substrate using a wave solder process. The solder also fills via holes in the substrate at each solder structure site. An integrated circuit is bonded to the top surface of the substrate using a conventional tape automated bonding (TAB) process or other suitable bonding process. The preferred shape of the solder structure is a cone, but other shapes, including hemispheres, columns and pyramids can be produced using a mold with suitably shaped cavities. The mold is preferably as large as an entire substrate panel so that a large number of device sites can be processed simultaneously.

Abstract: A ball grid array (BGA) package which contains an integrated circuit die that is directly mounted to either a heat sink or a printed circuit board. In one embodiment, the package has an integrated circuit with surface pads that are coupled to a flexible circuit board. Solder balls are attached to the flexible circuit board and solder the BGA package to a printed circuit board. The flexible circuit has an opening that exposes the integrated circuit and allows the IC to be soldered to the printed circuit board by solder balls attached directly to the surface pads of the IC die. The direct attachment between the die and printed circuit board increases the number of IC output pins. The flexible circuit board and die are covered by a protective injection molded plastic housing. In a second embodiment, the integrated circuit die is flipped upside down and a surface of the die is exposed through the plastic housing.

Abstract: An apparatus for surface mounting an integrated circuit package onto a printed circuit board. Cantilever beams from a housing member extend inwardly toward a central opening and reside upon portion of the lead making contact to the printed circuit board. A tightening of the housing member onto the circuit board by retaining means causes the cantilever beam to provide a downward force to maintain lead contact to the electrical contact, as well as a sideward force for retaining the integrated circuit stationary.