Patents by Inventor Kevin Harnist

Kevin Harnist has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12265172
    Abstract: This document describes techniques and systems for a vertical microstrip-to-waveguide transition. A radar system may include a monolithic microwave integrated circuit (MIMIC) to generate electromagnetic signals and a printed circuit board (PCB) that includes a first surface, a microstrip, and a grounding pattern. The microstrip can be located on the first surface and operatively connect to the MIMIC. The grounding pattern is located on the first surface and made of conductive material. The radar system also includes a transition channel positioned over the grounding pattern, which includes a vertical taper between a bottom surface and a top surface. The transition channel defines a dielectric-filled portion formed by the grounding pattern and its interior surface. The described vertical transition can reduce manufacturing costs and support a wide bandwidth by tolerating an air gap at the transition-to-waveguide interface.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: April 1, 2025
    Assignee: Aptiv Technologies AG
    Inventors: Syed An Nazmus Saqueb, Biswadeep Das Gupta, Kevin Harnist
  • Publication number: 20230384414
    Abstract: This document describes techniques and systems for a vertical microstrip-to-waveguide transition. A radar system may include a monolithic microwave integrated circuit (MIMIC) to generate electromagnetic signals and a printed circuit board (PCB) that includes a first surface, a microstrip, and a grounding pattern. The microstrip can be located on the first surface and operatively connect to the MIMIC. The grounding pattern is located on the first surface and made of conductive material. The radar system also includes a transition channel positioned over the grounding pattern, which includes a vertical taper between a bottom surface and a top surface. The transition channel defines a dielectric-filled portion formed by the grounding pattern and its interior surface. The described vertical transition can reduce manufacturing costs and support a wide bandwidth by tolerating an air gap at the transition-to-waveguide interface.
    Type: Application
    Filed: May 25, 2022
    Publication date: November 30, 2023
    Inventors: Syed An Nazmus Saqueb, Biswadeep Das Gupta, Kevin Harnist