Patents by Inventor Kevin Harris Becker

Kevin Harris Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • B-stageable and skip-curable wafer back side coating adhesives
    Patent number: 8759422
    Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: June 24, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Eric C. Wang, Kevin Harris Becker, Qizhuo Zhuo
  • Photocurable dicing die bonding tape
    Patent number: 8546485
    Abstract: A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: October 1, 2013
    Assignee: Henkel Corporation
    Inventors: Byoungchul Lee, Pauline Chiang, Kevin Harris Becker
  • Dual cure B-stageable adhesive for die attach
    Publication number: 20030129438
    Abstract: Curable compositions that comprise two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate.
    Type: Application
    Filed: December 14, 2001
    Publication date: July 10, 2003
    Inventors: Kevin Harris Becker, Harry Richard Kuder