Abstract: A radio-frequency (RF) power variable capacitor capable of operating at, at least, 50 watts in the MHz range. The capacitor has a composite HDK-NDK ceramic dielectric. The HDK (high dielectric constant) component comprises an active matrix of barium strontium titanate, for example. Acoustic resonances are reduced or eliminated by the addition of a metal or metalloid oxide such as magnesium borate (NDK—low dielectric constant), which acts as an acoustic resonance reduction agent (ARRA) in the RF power domain. The acoustic resonances which previously occurred under bias voltage 500 V or 1100 V in prior art RF power variable capacitors are eliminated by the addition of the ARRA.

Abstract: A radio-frequency (RF) power variable capacitor capable of operating at, at least, 50 watts in the MHz range. The capacitor has a composite HDK-NDK ceramic dielectric. The HDK (high dielectric constant) component comprises an active matrix of barium strontium titanate, for example. Acoustic resonances are reduced or eliminated by the addition of a metal or metalloid oxide such as magnesium borate (NDK—low dielectric constant), which acts as an acoustic resonance reduction agent (ARRA) in the RF power domain. The acoustic resonances which previously occurred under bias voltage 500 V or 1100 V in prior art RF power variable capacitors are eliminated by the addition of the ARRA.

Abstract: Testing apparatus operable to collect optical performance data of optoelectronic devices at different temperatures includes thermal-adjustment devices in thermal and mechanical contact with the optoelectronic devices via optoelectronic device stages. The thermal-adjustment devices can direct thermal energy to the optoelectronic devices under test without heating test targets in close proximity. Consequently, in some instances, spurious results can be avoided and rapid measurement of the optoelectronic devices different temperatures can be achieved.

Abstract: Testing apparatus operable to collect optical performance data of optoelectronic devices at different temperatures includes thermal-adjustment devices in thermal and mechanical contact with the optoelectronic devices via optoelectronic device stages. The thermal-adjustment devices can direct thermal energy to the optoelectronic devices under test without heating test targets in close proximity. Consequently, in some instances, spurious results can be avoided and rapid measurement of the optoelectronic devices different temperatures can be achieved.

Abstract: An optoelectronic module that includes a reflectance member which exhibits mitigated or eliminated fan-out field-of-view overlap can be concealed or its visual impact minimized compared to a host device in which the optoelectronic module is mounted. In some instances, the reflectance member can be implemented as a plurality of through holes and in other instances the reflectance member may be a contiguous spin-coated polymeric coating. In general, the reflectance member can be diffusively reflective to the same particular wavelengths or ranges of wavelengths as the host device in which it is mounted.

Abstract: An optoelectronic module that includes a reflectance member which exhibits mitigated or eliminated fan-out field-of-view overlap can be concealed or its visual impact minimized compared to a host device in which the optoelectronic module is mounted. In some instances, the reflectance member can be implemented as a plurality of through holes and in other instances the reflectance member may be a contiguous spin-coated polymeric coating. In general, the reflectance member can be diffusively reflective to the same particular wavelengths or ranges of wavelengths as the host device in which it is mounted.