Abstract: Provided are technologically improved systems and methods for providing terrain and runway feedback for an aircraft over a secured datalink. The method utilizes a controller onboard the aircraft and one on the ground. The controller onboard the aircraft performs the operations of: formatting a data package of mobile platform data; confirming the aircraft has a valid subscription service; securing the data package using a security protocol; and transmitting the data package via a secured datalink. The ground controller performs the operations of: confirming the subscription service of the aircraft; validating the security protocol used on the data package; decoding and processing the data with map extraction, threat detection, and image generation to generate raw terrain and runway feedback data; and transmitting the raw data using the secured datalink. An alert controller is used to generate alert commands for various alert devices based on the raw terrain and runway feedback data.

Abstract: Provided are technologically improved systems and methods for providing terrain and runway feedback for an aircraft over a secured datalink. The method utilizes a controller onboard the aircraft and one on the ground. The controller onboard the aircraft performs the operations of: formatting a data package of mobile platform data; confirming the aircraft has a valid subscription service; securing the data package using a security protocol; and transmitting the data package via a secured datalink. The ground controller performs the operations of: confirming the subscription service of the aircraft; validating the security protocol used on the data package; decoding and processing the data with map extraction, threat detection, and image generation to generate raw terrain and runway feedback data; and transmitting the raw data using the secured datalink. An alert controller is used to generate alert commands for various alert devices based on the raw terrain and runway feedback data.

Abstract: A system and method for converting onboard battery-powered, free-flight drones into ground-powered tethered drones that overcome the impediments designed into safeguarded free-flight drones. In combination with a ground-sourced power supply for the drone, power being delivered to the drone through a tether, the system comprises a battery emulating module that provides false signals to the drone's battery circuit board such that the onboard batteries may be removed and the alternative ground-based power source utilized without causing the drone's main circuit board to initiate a systems shutdown.

Abstract: A system and method for converting onboard battery-powered, free-flight drones into ground-powered tethered drones that overcome the impediments designed into safeguarded free-flight drones. In combination with a ground-sourced power supply for the drone, power being delivered to the drone through a tether, the system comprises a battery emulating module that provides false signals to the drone's battery circuit board such that the onboard batteries may be removed and the alternative ground-based power source utilized without causing the drone's main circuit board to initiate a systems shutdown.

Abstract: A retractable centesis needle comprises a hollow, sharp tipped outer cannula extending from a housing. The outer cannula is generally tube-like and open at both ends to form a channel into a cavity in the housing. A blunt tipped inner cannula is disposed within the channel and capable of sliding away from the housing to an extended state and toward the housing to a refracted state. The inner cannula is biased toward the extended state by a first spring disposed in the housing. A second spring also disposed in the housing acts in the same direction as the first spring when the inner cannula is in a fully retracted state. However, the second spring does not bias the inner cannula in any direction when the inner cannula is in a fully extended state.

Abstract: A retractable centesis needle comprises a hollow, sharp tipped outer cannula extending from a housing. The outer cannula is generally tube-like and open at both ends to form a channel into a cavity in the housing. A blunt tipped inner cannula is disposed within the channel and capable of sliding away from the housing to an extended state and toward the housing to a refracted state. The inner cannula is biased toward the extended state by a first spring disposed in the housing. A second spring also disposed in the housing acts in the same direction as the first spring when the inner cannula is in a fully retracted state. However, the second spring does not bias the inner cannula in any direction when the inner cannula is in a fully extended state.

Abstract: A drone system includes a drone that includes a propulsion system, a flight stabilizer system, and an air payload interface unit, and a camera system, wherein the camera system includes a camera stabilizing unit, and a ground support system to which the drone is detachably coupled through a tether unit, and for providing electrical power to the propulsion system. The drone system further includes a ground payload interface unit for receiving and transmitting command and telemetry information to the air payload interface unit through the tether unit, and a controlling device for controlling the propulsion system and the camera system through the tether unit.

Abstract: A drone system includes a drone that includes a propulsion system, a flight stabilizer system, and an air payload interface unit, and a camera system, wherein the camera system includes a camera stabilizing unit, and a ground support system to which the drone is detachably coupled through a tether unit, and for providing electrical power to the propulsion system. The drone system further includes a ground payload interface unit for receiving and transmitting command and telemetry information to the air payload interface unit through the tether unit, and a controlling device for controlling the propulsion system and the camera system through the tether unit.

Abstract: A portable wound care kit sized, shaped, and configured to carry only articles necessary for wound care treatment. In one embodiment, the wound care kit contains only a container of wound treatment medicament and two or more wound coverings. However, the wound care kit may also be configured to carry wound cleansing wipes or wound wash. The wound care kit is configured to permit ready and easy access to the wound care treatment articles.

Abstract: A portable wound care kit sized, shaped, and configured to carry only articles necessary for wound care treatment. In one embodiment, the wound care kit contains only a container of wound treatment medicament and two or more wound coverings. However, the wound care kit may also be configured to carry wound cleansing wipes or wound wash. The wound care kit is configured to permit ready and easy access to the wound care treatment articles.

Abstract: A method provides an interconnect structure having enhanced structural support when underlying functional metal layers are insulated with a low modulus dielectric. A first metal layer having a plurality of openings overlies the substrate. A first electrically insulating layer overlies the first metal layer. A second metal layer overlies the first electrically insulating layer, the second metal layer having a plurality of openings. An interconnect pad that defines an interconnect pad area overlies the second metal layer. At least a certain amount of the openings in the two metal layers are aligned to improve structural strength of the interconnect structure. The amount of alignment may differ depending upon the application and materials used. A bond wire connection or conductive bump may be used with the interconnect structure.

Abstract: A bond pad for an electronic device such as an integrated circuit makes electrical connection to an underlying device via an interconnect layer. The bond pad has a first layer of a material that is aluminum and copper and a second layer, over the first layer, of a second material that is aluminum and is essentially free of copper. The second layer functions as a cap to the first layer for preventing copper in the first layer from being corroded by residual chemical elements. A wire such as a gold wire may be bonded to the second layer of the bond pad.

Abstract: A semiconductor package (10) uses a plurality of thermal conductors (56-64) that extend upward within an encapsulant (16) from one or more thermal bond pads (22, 24, 26) on a die (14) to disperse heat. The thermal conductors may be bond wires or conductive stud bumps and do not extend beyond a lateral edge of the die. One or more of the thermal conductors may be looped within the encapsulant and exposed at an upper surface of the encapsulant. In one form a heat spreader (68) is placed overlying the encapsulant for further heat removal. In another form the heat spreader functions as a power or ground terminal directly to points interior to the die via the thermal conductors. Active bond pads may be placed exclusively along the die's periphery or also included within the interior of the die.

Abstract: An integrated circuit has a semiconductor substrate and an interconnect layer that mechanically relatively weak and susceptible to cracks and delamination. In the formation of the integrated circuit from a semiconductor wafer, a cut is made through the interconnect layer to form an edge of the interconnect layer. This cut may continue completely through the wafer thickness or stop short of doing so. In either case, after cutting through the interconnect layer, a reconditioning layer is formed on the edge of the interconnect layer. This reconditioning layer seals the existing cracks and delaminations and inhibits the further delamination or cracking of the interconnect layer. The sealing layer may be formed, for example, before the cut through the wafer, after the cut through the wafer but before any packaging, or after performing wirebonding between the interconnect layer and an integrated circuit package.

Abstract: A method provides an interconnect structure having enhanced structural support when underlying functional metal layers are insulated with a low modulus dielectric. A first metal layer having a plurality of openings overlies the substrate. A first electrically insulating layer overlies the first metal layer. A second metal layer overlies the first electrically insulating layer, the second metal layer having a plurality of openings. An interconnect pad that defines an interconnect pad area overlies the second metal layer. At least a certain amount of the openings in the two metal layers are aligned to improve structural strength of the interconnect structure. The amount of alignment may differ depending upon the application and materials used. A bond wire connection or conductive bump may be used with the interconnect structure.

Abstract: A technique for alleviating the problems of defects caused by stress applied to bond pads (32) includes, prior to actually making an integrated circuit (10), adding dummy metal lines (74, 76) to interconnect layers (18, 22, 26) to increase the metal density of the interconnect layers. These problems are more likely when the interlayer dielectrics (16, 20, 24) between the interconnect layers are of a low-k material. A critical area or force area (64) around and under each bond pad defines an area in which a defect may occur due to a contact made to that bond pad. Any interconnect layer in such a critical area that has a metal density below a certain percentage can be the cause of a defect in the interconnect layers. Any interconnect layer that has a metal density below that percentage in the critical area has dummy metal lines added to it.

Abstract: An integrated circuit die (10) includes a substrate (64), a plurality of metal interconnect layers (62) formed over the substrate (64), an insulating layer (58), a first pad (12), a second pad (14), and a probe pad (16). The first pad (12) is formed over the insulating layer (58) at an edge (11) of the integrated circuit die (10). The second pad (14) is formed over the insulating layer (58) adjacent to the first pad (12) on a side of the first pad (12) that is opposite to the edge (11). The probe pad (16) is formed over the insulating layer (58) on a side of the second pad (14) that is opposite to the edge (11), wherein the probe pad (16) is electrically connected to the first pad (12). The probe pad (16) may be formed over active circuitry of the substrate instead of over a peripheral area of the die (10), thus reducing the surface area of the die (10).

Abstract: A method of making a semiconductor device includes forming a wafer having a substrate and an interconnect structure over the substrate. The wafer also includes a plurality of die areas and a street located between a first die area of the plurality and a second die area of the plurality. A separation structure that includes metal is located in the interconnect structure. At least a portion of the separation structure is located in a saw kerf of the street. The separation structure is arranged to provide a predefined separation path for separating the first die area during a singulation process.

Abstract: A bond pad (200) has a first wire bond region (202) and a second wire bond region (204). In one embodiment, the first wire bond region (202) extends over a passivation layer (18). In an alternate embodiment, a bond pad (300) has a probe region (302), a first wire bond region (304), and a second wire bond region (306). In one embodiment, the probe region (302) and the wire bond region (304) extend over a passivation layer (18). The bond pads may have any number of wire bond and probe regions and in any configuration. The ability for the bond pads to have multiple wire bond regions allows for multiple wire connections to a single bond pad, such as in multi-chip packages. The ability for the bond pads to extend over the passivation layer also allows for reduced integrated circuit die area.

Abstract: A bond pad (200) has a first wire bond region (202) and a second wire bond region (204). In one embodiment, the first wire bond region (202) extends over a passivation layer (18). In an alternate embodiment, a bond pad (300) has a probe region (302), a first wire bond region (304), and a second wire bond region (306). In one embodiment, the probe region (302) and the wire bond region (304) extend over a passivation layer (18). The bond pads may have any number of wire bond and probe regions and in any configuration. The ability for the bond pads to have multiple wire bond regions allows for multiple wire connections to a single bond pad, such as in multi-chip packages. The ability for the bond pads to extend over the passivation layer also allows for reduced integrated circuit die area.