Abstract: Described herein are systems and methods for tracking, monitoring, projecting and reporting billing information. One embodiment is related to a computer readable storage medium including a set of instructions that are executable by a processor, the set of instructions being operable to receive billing data from at least one billing process, analyze changes in the at least one billing process, monitor the at least one billing process for an occurrence of time-based events, reconcile unique identifiers within the billing data to verify data integrity, generate a billing report based on the changes, the time-based events and data integrity, and audit the billing report for format errors.

Abstract: An improved technique for power distribution for use by high speed integrated circuit devices. A mixture of high dielectric constant, Er and low Er materials are used in a dielectric layer sandwiched between the voltage and ground planes of a printed circuit board that is used to fixture one or more integrated circuit devices. The low Er material is used in an area contained by the location of the integrated circuit device and its corresponding decoupling capacitors located nearby. High Er material is used in areas between the regions of low Er material. The low Er material improves that speed at which current from an adjoining decoupling capacitor can propagate to a power pin of the integrated circuit device. The high Er material mitigates cross-coupling of noise between the low Er regions.

Abstract: An improved technique for power distribution for use by high speed integrated circuit devices. A mixture of high dielectric constant, Er and low Er materials are used in a dielectric layer sandwiched between the voltage and ground planes of a printed circuit board that is used to fixture one or more integrated circuit devices. The low Er material is used in an area contained by the location of the integrated circuit device and its corresponding decoupling capacitors located nearby. High Er material is used in areas between the regions of low Er material. The low Er material improves that speed at which current from an adjoining decoupling capacitor can propagate to a power pin of the integrated circuit device. The high Er material mitigates cross-coupling of noise between the low Er regions.