Patents by Inventor Kevin Ihwa Tzou

Kevin Ihwa Tzou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8730618
    Abstract: An integrated lead suspension (ILS) has a constrained layer damper (CLD) that attenuates vibration of the ILS. The CLD may be applied over an already assembled ILS such that the CLD is applied to the cover layer, to the base layer, or to both. Alternatively, the ILS may be encapsulated via a deposition process such that a damping layer is sandwiched between the conductor layer and the cover layer of the ILS, between the conductor layer and the dielectric layer of the ILS, or both.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: May 20, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Jen-Yuan Chang, Kevin Ihwa Tzou
  • Patent number: 7903376
    Abstract: An integrated lead suspension (ILS) has a constrained layer damper (CLD) that attenuates vibration of the ILS. The CLD is applied over an already assembled ILS such that the CLD is applied to the cover layer. The CLD encapsulates the underlying conductors and the cover layer. The damping layer is formed on the cover layer. The width of damping layer is substantially equal to the width of cover layer as it extends over the conductors. The constraining layer extends laterally beyond the width of the damping and cover layers and down to the dielectric layer, which resides on a base layer. The constraining layer has a lateral width equal to that of the dielectric layer.
    Type: Grant
    Filed: April 16, 2007
    Date of Patent: March 8, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
    Inventors: Jen-Yuan Chang, Kevin Ihwa Tzou
  • Publication number: 20110026165
    Abstract: An integrated lead suspension (ILS) has a constrained layer damper (CLD) that attenuates vibration of the ILS. The CLD may be applied over an already assembled ILS such that the CLD is applied to the cover layer, to the base layer, or to both. Alternatively, the ILS may be encapsulated via a deposition process such that a damping layer is sandwiched between the conductor layer and the cover layer of the ILS, between the conductor layer and the dielectric layer of the ILS, or both.
    Type: Application
    Filed: October 12, 2010
    Publication date: February 3, 2011
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Jen-Yuan Chang, Kevin Ihwa Tzou
  • Publication number: 20080253028
    Abstract: An integrated lead suspension (ILS) has a constrained layer damper (CLD) that attenuates vibration of the ILS. The CLD may be applied over an already assembled ILS such that the CLD is applied to the cover layer, to the base layer, or to both. Alternatively, the ILS may be encapsulated via a deposition process such that a damping layer is sandwiched between the conductor layer and the cover layer of the ILS, between the conductor layer and the dielectric layer of the ILS, or both.
    Type: Application
    Filed: April 16, 2007
    Publication date: October 16, 2008
    Inventors: Jen-Yuan Chang, Kevin Ihwa Tzou