Patents by Inventor Kevin J. Bouck

Kevin J. Bouck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210292499
    Abstract: The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a thermosetting resin mixture and a fiber material component of a heat resistant fiber, such as carbon fiber, having an areal weight of from 500 to 3,000 g/m2 having a coating of from 0.5 to 4 phr of a latent, particulate curative or solid curative, preferably, dicyandiamide, wherein the prepregs are infused with a thermosetting resin mixture comprising (a) at least one liquid epoxy resin, and (b) a hardener and/or a catalyst, as well as methods of making the same. The prepregs of present invention enables the simple provision of lightweight composites having consistent resin cure throughout.
    Type: Application
    Filed: August 30, 2017
    Publication date: September 23, 2021
    Inventors: David H. Bank, Richard Baumer, Kevin J. Bouck, Jun Cai, Marsha L. Langhorst, Abhijit A. Namjoshi, Weijun Wang
  • Publication number: 20210155798
    Abstract: A composition comprising the following components: A) a metal stearate; B) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, wherein x=7; C) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, C wherein x=20; D) octanoic acid; E) sodium lauryl sulfate; F) a polydimethylsiloxane (PDMS); and G) water.
    Type: Application
    Filed: June 25, 2019
    Publication date: May 27, 2021
    Inventors: Nicholas B. Schaffer, Kevin J. Bouck, Sarah E. Decato, Shrikant Dhodapkar, Intan M. Hamdan, Remi A. Trottier, Richard A. Lundgard
  • Publication number: 20210115202
    Abstract: A method of preparing a resin infused random fiber mat including the step of forming a liquid dispersion mat of polymeric resin and fiber on a porous substrate.
    Type: Application
    Filed: February 14, 2018
    Publication date: April 22, 2021
    Inventors: Craig F. Gorin, Manesh Nadupparambil Sekharan, Jason A. Reese, Amit K. Chaudhary, Daniel L. Dermody, Kevin J. Bouck, Rebekah K. Feist, Thomas J. Parsons, David H. Bank
  • Patent number: 9353233
    Abstract: Disclosed herein are polyisocyanurate and/or polyurethane foams containing non-porous silica particles derived from mesoporous cellular foams, wherein the polyisocyanurate and/or polyurethane foams have enhanced heat and/or fire resistance. Processes for making such foams and methods of using them are also disclosed.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: May 31, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Scott T. Matteucci, William G. Stobby, Daniel T. Youmans, Jr., Beata A. Kilos, Cathy L. Tway, Dean Millar, Kevin J. Bouck
  • Publication number: 20140363666
    Abstract: Disclosed herein are polyisocyanurate and/or polyurethane foams containing non-porous silica particles derived from mesoporous cellular foams, wherein the polyisocyanurate and/or polyurethane foams have enhanced heat and/or fire resistance. Processes for making such foams and methods of using them are also disclosed.
    Type: Application
    Filed: January 24, 2013
    Publication date: December 11, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Scott T. Matteucci, William G. Stobby, Daniel T. Youmans, JR., Beata A. Kilos, Cathy L. Tway, Dean Millar, Kevin J. Bouck
  • Publication number: 20100136273
    Abstract: The present invention is an article of construction formed from an article adhesively-bonded to a layering material through (a) reactive coupling of a functionalized nitroxide or (b) the adhesion of components in a polymer matrix made from or containing a polymer, an organic peroxide, and a functionalized nitroxide. The initial article may be expanded. It may also be polar or nonpolar. Similarly, the layering material may be polar or nonpolar. Other embodiments of the present invention are described, including other articles and methods for preparing the articles.
    Type: Application
    Filed: October 9, 2007
    Publication date: June 3, 2010
    Inventors: Miguel A. Prieto, Peter Sandkuehler, Antonio Batistini, Sandra Hofmann, Stephen F. Hahn, Mohamed Esseghir, Monika Plass, Mark F. Sonnenschein, H. Craig Silvis, Hamed Lakrout, Kevin J. Bouck, Muthu Subramanian, Jinder Jow, Thiam Aik Lim, Stephen Y. Cheng, Lester Yeong
  • Publication number: 20080087380
    Abstract: The present invention is an article of construction formed from an article adhesively-bonded to a layering material through (a) reactive coupling of a functionalized nitroxide or (b) the adhesion of components in a polymer matrix made from or containing a polymer, an organic peroxide, and a functionalized nitroxide. The initial article may be expanded. The initial article may be expanded. It may also be polar or nonpolar. Similarly, the layering material may be polar or nonpolar. Other embodiments of the present invention are described, including other articles and methods for preparing the articles.
    Type: Application
    Filed: October 13, 2006
    Publication date: April 17, 2008
    Applicant: Dow Global Technologies Inc.
    Inventors: Miguel A. Prieto Goubert, Peter Sandkuehler, Antonio Batistini, Sandra Hofmann, Stephen F. Hahn, Mohamed Esseghir, Monika Plass, Mark F. Sonnenschein, H. Craig Silvis, Hamed Lakrout, Kevin J. Bouck
  • Patent number: 7109249
    Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: September 19, 2006
    Assignee: Dow Global Technologies Inc.
    Inventors: Kenneth J. Bruza, James P. Godschalx, Edward O. Shaffer, II, Dennis W. Smith, Jr., Paul H. Townsend, III, Kevin J. Bouck, Qing Shan J. Niu
  • Patent number: 6887910
    Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: May 3, 2005
    Assignee: Dow Global Technologies Inc.
    Inventors: Kenneth J. Bruza, James P. Godschalx, Edward O. Shaffer, II, Dennis W. Smith, Jr., Paul H. Townsend, III, Kevin J. Bouck, Qing Shan J. Niu
  • Patent number: 6653358
    Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: November 25, 2003
    Assignee: Dow Global Technologies Inc.
    Inventors: Kenneth J. Bruza, James P. Godschalx, Edward O. Shaffer, II, Dennis W. Smith, Jr., Paul H. Townsend, III, Kevin J. Bouck, Qing Shan J. Niu
  • Patent number: 6630520
    Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: October 7, 2003
    Assignee: Dow Global Technologies Inc.
    Inventors: Kenneth J. Bruza, James P. Godschalx, Edward O. Shaffer, II, Dennis W. Smith, Jr., Paul H. Townsend, III, Kevin J. Bouck, Qing Shan J. Niu
  • Publication number: 20030165625
    Abstract: Applicants found that selection of reactive nanoparticles as poragens when combined with monomeric precusors to organic, particularly polyarylene or polyarylene ether, matrix materials are effective in obtaining very small pore sizes.
    Type: Application
    Filed: February 15, 2002
    Publication date: September 4, 2003
    Inventors: Ying Hung So, Q. Jason Niu, Paul H. Townsend, Steve J. Martin, Thomas H. Kalantar, James Peter Godschalx, Kennethus J. Bruza, Kevin J. Bouck
  • Publication number: 20030092785
    Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
    Type: Application
    Filed: October 29, 2002
    Publication date: May 15, 2003
    Inventors: Kenneth J. Bruza, James P. Godschalx, Edward O. Shaffer, Dennis W. Smith, Paul H. Townsend, Kevin J. Bouck, Qing Shan J. Niu
  • Publication number: 20030083392
    Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
    Type: Application
    Filed: October 29, 2002
    Publication date: May 1, 2003
    Inventors: Kenneth J. Bruza, James P. Godschalx, Edward O. Shaffer, Dennis W. Smith, Paul H. Townsend, Kevin J. Bouck, Qing Shan J. Niu